Footprints
1,347 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.65x5.65mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.65x5.65mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-42-1EP_3.5x9mm_P0.5mm_EP2.05x7.55mm_ThermalVias
Package_DFN_QFN
WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23, https://www.diodes.com/assets/Package-Files/PD-2035J_ZH42.pdf)
- Pads
- 43
- SMD
- 4.8×10.3
- Boards
- —
Nordic_nRF9151-LAxx_LGA-80-33EP_12.1x11.1mm_P0.5mm
Package_LGA
nRF9151 (https://docs.nordicsemi.com/bundle/ps_nrf9151/page/mec_spec.html)
- Pads
- 113
- SMD
- 12.6×11.6
- Boards
- —
Nordic_nRF9160-SIxx_LGA-102-59EP_16.0x10.5mm_P0.5mm
Package_LGA
nRF9160 (https://docs.nordicsemi.com/bundle/ps_nrf9160/page/mec_spec.html)
- Pads
- 127
- SMD
- 16.9×11.4
- Boards
- —
ublox_LGA-53_4.5x4.5mm_Layout9x9_P0.5mm
Package_LGA
ublox MIA SoC Module, 4.5x4.5mm, 53 Ball, 9x9 Layout, 0.5mm Pitch, https://content.u-blox.com/sites/default/files/documents/MIA-M10Q_IntegrationManual_UBX-21028173.pdf#page=82
- Pads
- 53
- SMD
- 6.5×6.5
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP5x5mm
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP6.61x5.615mm
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP6.61x5.615mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP8.93x8.7mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm
Package_QFP
LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm_ThermalVias
Package_QFP
LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
LQFP-128_14x20mm_P0.5mm
Package_QFP
LQFP, 128 Pin (https://www.nxp.com/docs/en/package-information/SOT425-1.pdf)
- Pads
- 128
- SMD
- 17.4×23.4
- Boards
- —