Footprints

1,260 footprints matching “32”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,260 footprints · page 51 of 53

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QFN-32-1EP_7x7mm_P0.65mm_EP5.4x5.4mm

FP—

Package_DFN_QFN

QFN, 32 Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf)

Pads: 33
SMD: 8.3×8.3
Boards: —

QFN-32-1EP_7x7mm_P0.65mm_EP5.4x5.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 32 Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf)

Pads: 33
SMD: 8.3×8.3
Boards: —

Texas_RHB0032E_VQFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

Texas RHB0032E VQFN, 32 Pin (http://www.ti.com/lit/ds/symlink/msp430f1122.pdf#page=54)

Pads: 33
SMD: 6.3×6.3
Boards: —

Texas_RHB0032M_VQFN-32-1EP_5x5mm_P0.5mm_EP2.1x2.1mm

FP—

Package_DFN_QFN

Texas RHB0032M VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/dp83td510e.pdf#page=91)

Pads: 33
SMD: 6.2×6.2
Boards: —

Texas_RHB0032M_VQFN-32-1EP_5x5mm_P0.5mm_EP2.1x2.1mm_ThermalVias

FP—

Package_DFN_QFN

Texas RHB0032M VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/dp83td510e.pdf#page=91)

Pads: 33
SMD: 6.2×6.2
Boards: —

Texas_RSN_WQFN-32-1EP_4x4mm_P0.4mm_EP2.8x2.8mm

FP—

Package_DFN_QFN

Texas RSN WQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90)

Pads: 33
SMD: 5.3×5.3
Boards: —

Texas_RWH0032A

FP—

Package_DFN_QFN

Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf)

Pads: 33
SMD: 8.9×8.9
Boards: —

Texas_RWH0032A_ThermalVias

FP—

Package_DFN_QFN

Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf)

Pads: 33
SMD: 8.9×8.9
Boards: —

TQFN-32-1EP_5x5mm_P0.5mm_EP2.1x2.1mm

FP—

Package_DFN_QFN

TQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-6))

Pads: 33
SMD: 6.2×6.2
Boards: —

TQFN-32-1EP_5x5mm_P0.5mm_EP2.1x2.1mm_ThermalVias

FP—

Package_DFN_QFN

TQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-6))

Pads: 33
SMD: 6.2×6.2
Boards: —

TQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

TQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-3))

Pads: 33
SMD: 6.2×6.2
Boards: —

TQFN-32-1EP_5x5mm_P0.5mm_EP3.4x3.4mm

FP—

Package_DFN_QFN

TQFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9))

Pads: 33
SMD: 6.2×6.2
Boards: —

UFQFPN-32-1EP_5x5mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP—

Package_DFN_QFN

UFQFPN, 32 Pin (https://www.st.com/resource/en/datasheet/stm32g071k8.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: —

UQFN-32_5x5mm_P0.5mm

FP3D

Package_DFN_QFN

UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)

Pads: 32
SMD: 6.2×6.2
Boards: —

VQFN-32-1EP_4x4mm_P0.4mm_EP2.8x2.8mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/tps25750.pdf#page=78)

Pads: 33
SMD: 5.3×5.3
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

DIP-32_W15.24mm_SMDSocket_SmallPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), SMDSocket, SmallPads

Pads: 32
SMD: 18.3×41.3
Boards: —

DIP-32_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 32
SMD: 20.1×41.3
Boards: —

SMDIP-32_W11.48mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 32
SMD: 14.0×41.2
Boards: —

SMDIP-32_W15.24mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads: 32
SMD: 17.8×41.2
Boards: —

SMDIP-32_W7.62mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 32
SMD: 10.1×41.2
Boards: —

SMDIP-32_W9.53mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 32
SMD: 12.0×41.2
Boards: —

TQFP-32_5x5mm_P0.5mm

FP—

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation AAA, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 32
SMD: 8.3×8.3
Boards: —