Footprints

15,503 footprints matching “I”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

15,503 footprints · page 595 of 646

Matched by name and keywords. Search by meaning instead

DirectFET_SC

FP—

Package_DirectFET

DirectFET SC https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=24

Pads: 3
SMD: 6.3×4.3
Boards: —

DirectFET_SH

FP3D

Package_DirectFET

DirectFET SH https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=19

Pads: 3
SMD: 6.3×4.3
Boards: —

DirectFET_SJ

FP3D

Package_DirectFET

DirectFET SJ https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=18

Pads: 3
SMD: 6.3×4.3
Boards: —

DirectFET_SQ

FP3D

Package_DirectFET

DirectFET SQ https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=17

Pads: 3
SMD: 6.3×4.3
Boards: —

DirectFET_ST

FP3D

Package_DirectFET

DirectFET ST https://www.infineon.com/dgdl/Infineon-AN-1035-ApplicationNotes-v29_01-EN.pdf?fileId=5546d462533600a40153559159020f76#page=16

Pads: 3
SMD: 6.3×4.3
Boards: —

Linear_LGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_LGA

Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 133
SMD: 15.5×15.5
Boards: —

Nordic_nRF9151-LAxx_LGA-80-33EP_12.1x11.1mm_P0.5mm

FP—

Package_LGA

nRF9151 (https://docs.nordicsemi.com/bundle/ps_nrf9151/page/mec_spec.html)

Pads: 113
SMD: 12.6×11.6
Boards: —

Nordic_nRF9160-SIxx_LGA-102-59EP_16.0x10.5mm_P0.5mm

FP—

Package_LGA

nRF9160 (https://docs.nordicsemi.com/bundle/ps_nrf9160/page/mec_spec.html)

Pads: 127
SMD: 16.9×11.4
Boards: —

ST_CCLGA-7L_2.8x2.8mm_P1.15mm_H1.95mm

FP—

Package_LGA

ST CCLGA, 7 Pin (https://www.st.com/resource/en/datasheet/ilps28qsw.pdf#page=44)

Pads: 7
SMD: 3.3×3.3
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: —

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: —

ublox_LGA-53_4.5x4.5mm_Layout9x9_P0.5mm

FP—

Package_LGA

ublox MIA SoC Module, 4.5x4.5mm, 53 Ball, 9x9 Layout, 0.5mm Pitch, https://content.u-blox.com/sites/default/files/documents/MIA-M10Q_IntegrationManual_UBX-21028173.pdf#page=82

Pads: 53
SMD: 6.5×6.5
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP5x5mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP6.61x5.615mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP8.93x8.7mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

Hitachi_FP80B_PQFP-80_14x20mm_P0.8mm

FP—

Package_QFP

Hitachi FP80B PQFP, 80 Pin (Hitachi FP-80B, 2.70mm body thickness, https://www.icbase.com/pdf/HTH/HTH14270106.pdf#page=9, https://bitsavers.trailing-edge.com/components/hitachi/_dataBooks/1994_M24T026_Hitachi_LCD_Controller_Driver_LSI_Data_Book.pdf#page=28)

Pads: 80
SMD: 20.4×26.4
Boards: —

LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm_ThermalVias

FP—

Package_QFP

LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)

Pads: 101
SMD: 17.3×17.3
Boards: —

LQFP-144-1EP_20x20mm_P0.5mm_EP6.5x6.5mm

FP—

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, custom Exposed Pad from Infineon, https://www.infineon.com/dgdl/Infineon-XMC4500-DS-v01_05-EN.pdf#page=107, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 145
SMD: 23.3×23.3
Boards: —