Footprints

15,503 footprints matching “I”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

15,503 footprints · page 599 of 646

Matched by name and keywords. Search by meaning instead

SSO-8_9.6x6.3mm_P1.27mm_Clearance10.5mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads
8
SMD
14.9×6.7
Boards
—

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads
11
SMD
7.5×5.4
Boards
—

SSOP-40_8.8x17.5mm_P0.8mm

FP—

Package_SO

SSOP, 40 Pin (JEITA/EIAJ ED-7311-20 variation 40-001-GABB, 2.40mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311-20/#target/page_no=114)

Pads
40
SMD
13.3×18.0
Boards
—

ST_PowerSSO-24_SlugDown

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
25
SMD
12.1×10.8
Boards
—

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
25
SMD
12.1×10.8
Boards
—

ST_PowerSSO-24_SlugUp

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
24
SMD
12.1×10.8
Boards
—

ST_PowerSSO-36_SlugDown

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
37
SMD
12.1×10.8
Boards
—

ST_PowerSSO-36_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
37
SMD
12.1×10.8
Boards
—

ST_PowerSSO-36_SlugUp

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads
36
SMD
12.1×10.8
Boards
—

Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm_ThermalVias

FP—

Package_SO

Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)

Pads
9
SMD
6.4×3.5
Boards
—

Texas_DGN0008D_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.57x1.89mm_ThermalVias

FP—

Package_SO

Texas DGN0008D VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)

Pads
9
SMD
6.4×3.5
Boards
—

Texas_DGN0008G_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.846x2.15mm_ThermalVias

FP—

Package_SO

Texas DGN0008G VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)

Pads
9
SMD
6.4×3.5
Boards
—

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
15
SMD
7.8×5.5
Boards
—

Texas_PWP0028V_TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask2.94x5.62mm_ThermalVias

FP—

Package_SO

Texas PWP0028V TSSOP, 28 Pin (https://www.ti.com/lit/ds/symlink/lm5176.pdf?ts=1728516913971&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FLM5176)

Pads
29
SMD
7.8×10.2
Boards
—

Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)

Pads
4
SMD
8.0×4.1
Boards
—

Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)

Pads
5
SMD
8.0×4.1
Boards
—

TSOP-I-24_12.4x6mm_P0.5mm

FP3D

Package_SO

TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AA)

Pads
24
SMD
15.5×6.5
Boards
—

TSOP-I-24_14.4x6mm_P0.5mm

FP3D

Package_SO

TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AB)

Pads
24
SMD
17.5×6.5
Boards
—

TSOP-I-24_16.4x6mm_P0.5mm

FP3D

Package_SO

TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC)

Pads
24
SMD
19.5×6.5
Boards
—

TSOP-I-24_18.4x6mm_P0.5mm

FP3D

Package_SO

TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AD)

Pads
24
SMD
21.5×6.5
Boards
—

TSOP-I-32_16.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BC)

Pads
32
SMD
19.5×8.5
Boards
—

TSOP-I-40_12.4x10mm_P0.5mm

FP3D

Package_SO

TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CA)

Pads
40
SMD
15.5×10.5
Boards
—

TSOP-I-40_14.4x10mm_P0.5mm

FP3D

Package_SO

TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB)

Pads
40
SMD
17.5×10.5
Boards
—

TSOP-I-40_16.4x10mm_P0.5mm

FP3D

Package_SO

TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CC)

Pads
40
SMD
19.5×10.5
Boards
—