Footprints

1,347 footprints matching “0.5”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,347 footprints · page 6 of 57

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C_Rect_L26.5mm_W10.5mm_P22.50mm_MKS4

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=22.50mm, length*width=26.5*10.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf

Pads: 2
THT: 27.0×11.0
Boards: 12

SolderWire-0.5sqmm_1x01_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 3.8×3.3
Boards: 12

QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm

FP—

Package_DFN_QFN

QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 12

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 12

QFN-36-1EP_6x6mm_P0.5mm_EP4.1x4.1mm

FP—

Package_DFN_QFN

QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72)

Pads: 37
SMD: 7.3×7.3
Boards: 12

TDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF)

Pads: 9
SMD: 3.3×2.5
Boards: 12

WQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm

FP—

Package_DFN_QFN

WQFN, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56)

Pads: 17
SMD: 4.2×4.2
Boards: 12

TerminalBlock_MaiXu_MX126-5.0-04P_1x04_P5.00mm

FP—

TerminalBlock

terminal block MaiXu MX126-5.0-04P, 4 pins, pitch 5mm, size 20.5x7.8mm, drill diameter 1.3mm, pad diameter 2.8mm, https://www.lcsc.com/datasheet/lcsc_datasheet_2309150913_MAX-MX126-5-0-03P-GN01-Cu-S-A_C5188435.pdf

Pads: 4
THT: 21.5×8.8
Boards: 12

Fuseholder_Clip-5x20mm_Littelfuse_100_Inline_P20.50x4.60mm_D1.30mm_Horizontal

FP—

Fuse

Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 100, https://m.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_100_445_030_520_datasheet.pdf.pdf

Pads: 2
THT: 23.3×6.4
Boards: 11

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

WQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm

FP—

Package_DFN_QFN

WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33)

Pads: 25
SMD: 5.3×5.3
Boards: 11

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 11

C_Disc_D10.5mm_W5.0mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=10.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads: 2
THT: 11.0×5.5
Boards: 10

DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.5mm

FP—

Package_DFN_QFN

DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf)

Pads: 9
SMD: 3.2×2.5
Boards: 10

DFN-8-1EP_3x3mm_P0.5mm_EP1.65x2.38mm

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf#page=10)

Pads: 9
SMD: 4.3×3.5
Boards: 10

QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm

FP—

Package_DFN_QFN

QFN, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf)

Pads: 21
SMD: 4.8×4.8
Boards: 10

MSOP-16_3x4.039mm_P0.5mm

FP3D

Package_SO

MSOP, 16 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf)

Pads: 16
SMD: 6.3×4.5
Boards: 10

SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm

FP—

Package_SON

SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf)

Pads: 9
SMD: 3.6×2.5
Boards: 10

TE_1-1734839-0_1x10-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 10 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads: 11
SMD: 11.4×6.7
Boards: 9