Footprints
254 footprints matching “14mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Toroid_Horizontal_D28.0mm_P26.67mm_Bourns_2200
Inductor_THT
L_Toroid, Horizontal series, Radial, pin pitch=26.67mm, diameter=28mm, height=14mm, Bourns, 2200, http://www.bourns.com/docs/Product-Datasheets/2100_series.pdf?sfvrsn=3
- Pads
- 2
- THT
- 30.2×28.5
- Boards
- —
C_Plugin,D10xL14mm
jlcpcb-JLCPCB-Kicad-Footprints
CAP-TH_BD10.0-P5.00-D0.6-FD footprint
- Pads
- 2
- THT
- 10.0×10.0
- Boards
- —
Mounting_Wuerth_WA-SMSE-ExternalM3_H14mm_9771140360
Mounting_Wuerth
Mounting Hardware, external M3, height 14, Wuerth electronics 9771140360 (https://www.we-online.com/components/products/datasheet/9771140360R.pdf)
- Pads
- 1
- SMD
- 7.9×7.9
- Boards
- —
Mounting_Wuerth_WA-SMSI-M3_H14mm_9774140360
Mounting_Wuerth
Mounting Hardware, inside through hole M3, height 14, Wuerth electronics 9774140360 (https://www.we-online.com/components/products/datasheet/9774140360R.pdf)
- Pads
- 1
- SMD
- 7.9×7.9
- Boards
- —
Mounting_Wuerth_WA-SMST-3.3mm_H14mm_9774140960
Mounting_Wuerth
Mounting Hardware, inside through hole 3.3mm, height 14, Wuerth electronics 9774140960 (https://www.we-online.com/components/products/datasheet/9774140960R.pdf)
- Pads
- 1
- SMD
- 7.9×7.9
- Boards
- —
TQFP-128_14x14mm_P0.4mm_PAD
muratovas-MAS_Package_std
TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)
- Pads
- 129
- SMD
- 16.9×16.9
- Boards
- —
FBGA-96_8x14mm_Layout9x16_P0.8mm
Package_BGA
FBGA-96, 8.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, generalized from https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28
- Pads
- 96
- SMD
- 10.0×16.0
- Boards
- —
FBGA-96_9x14mm_Layout9x16_P0.8mm
Package_BGA
FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, generalized from https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26
- Pads
- 96
- SMD
- 11.0×16.0
- Boards
- —
LFBGA-289_14x14mm_Layout17x17_P0.8mm
Package_BGA
LFBGA-289, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp131c.pdf
- Pads
- 289
- SMD
- 16.0×16.0
- Boards
- —
MAPBGA-289_14x14mm_Layout17x17_P0.8mm
Package_BGA
MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1
- Pads
- 289
- SMD
- 16.0×16.0
- Boards
- —
ST_VFBGA-424_14x14mm_Layout27x27_P0.5mmP0.5x0.5mm_Stagger
Package_BGA
ST VFBGA-424, 14.0x14.0mm, 424 Ball, 27x27 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf
- Pads
- 424
- SMD
- 16.0×16.0
- Boards
- —
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm_ThermalVias
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- —
ST_WLCSP-18_1.86x2.14mm_Layout7x5_P0.4mm_Stagger
Package_CSP
ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf
- Pads
- 18
- SMD
- 3.9×4.2
- Boards
- —
ST_WLCSP-49_3.14x3.14mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, ST Die ID 01E, 3.14x3.14mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb07cc.pdf#page=62
- Pads
- 49
- SMD
- 5.1×5.1
- Boards
- —
Texas_RVA_VQFN-16-1EP_3.5x3.5mm_P0.5mm_EP2.14x2.14mm_ThermalVias
Package_DFN_QFN
Texas RVA VQFN, 16 Pin (https://www.ti.com/lit/pdf/MPQF232)
- Pads
- 17
- SMD
- 4.8×4.8
- Boards
- —
LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm
Package_QFP
LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm_ThermalVias
Package_QFP
LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
LQFP-64_14x14mm_P0.8mm
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT791-1.pdf)
- Pads
- 64
- SMD
- 17.4×17.4
- Boards
- —
PQFP-64_14x14mm_P0.8mm
Package_QFP
PQFP, 64 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-qfp-64pin-prqp0064gb)
- Pads
- 64
- SMD
- 18.7×18.7
- Boards
- —
PQFP-80_14x14mm_P0.65mm
Package_QFP
PQFP, 80 Pin (JEDEC MS-022 variation BC, 2.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 80
- SMD
- 18.5×18.5
- Boards
- —
TQFP-120_14x14mm_P0.4mm
Package_QFP
TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 932AZ.PDF)
- Pads
- 120
- SMD
- 16.9×16.9
- Boards
- —
TQFP-80_14x14mm_P0.65mm
Package_QFP
TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)
- Pads
- 80
- SMD
- 17.3×17.3
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —