Footprints

285 footprints matching “3x3mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

285 footprints · page 6 of 12

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Maxim_TDFN-12-1EP_3x3mm_P0.5mm_EP1.7x2.5mm_ThermalVias

FP—

Package_DFN_QFN

Maxim TDFN, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn/90-0397.pdf)

Pads: 13
SMD: 4.2×3.5
Boards: 1

Mini-Circuits_FG873-4_3x3mm

FP3D

Package_DFN_QFN

Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf)

Pads: 4
SMD: 5.2×5.2
Boards: 1

QFN-12-1EP_3x3mm_P0.5mm_EP1.65x1.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 12 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_12_%2005-08-1855.pdf)

Pads: 13
SMD: 4.3×4.3
Boards: 1

QFN-12-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP—

Package_DFN_QFN

QFN, 12 Pin (https://www.nxp.com/docs/en/data-sheet/MMZ09332B.pdf)

Pads: 13
SMD: 4.2×4.2
Boards: 1

QFN-12-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 12 Pin (https://www.nxp.com/docs/en/data-sheet/MMZ09332B.pdf)

Pads: 13
SMD: 4.2×4.2
Boards: 1

QFN-20-1EP_3x3mm_P0.45mm_EP1.6x1.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=212)

Pads: 21
SMD: 4.3×4.3
Boards: 1

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 1

ST_UFDFPN-12-1EP_3x3mm_P0.5mm_EP1.4x2.55mm

FP—

Package_DFN_QFN

ST UFDFPN, 12 Pin (https://www.st.com/resource/en/datasheet/st25dv04k.pdf#page=152)

Pads: 13
SMD: 4.3×3.5
Boards: 1

Texas_RTE_WQFN-16-1EP_3x3mm_P0.5mm_EP1.2x0.8mm

FP—

Package_DFN_QFN

Texas RTE WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40)

Pads: 17
SMD: 4.3×4.3
Boards: 1

UQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias

FP—

Package_DFN_QFN

UQFN, 20 Pin (https://www.kinet-ic.com/uploads/web/KTD2058,%20KTD2059,%20KTD2060,%20KTD2061/KTD2061-58-59-60-04e.pdf#page=25)

Pads: 21
SMD: 4.2×4.2
Boards: 1

UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm_ThermalVias

FP3D

Package_DFN_QFN

UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)

Pads: 21
SMD: 4.2×4.2
Boards: 1

VQFN-16-1EP_3x3mm_P0.5mm_EP1.1x1.1mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/16L_VQFN-WFS_3x3mm_4MX_C04-00508a.pdf)

Pads: 17
SMD: 4.2×4.2
Boards: 1

VQFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6)

Pads: 17
SMD: 4.3×4.3
Boards: 1

VQFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6)

Pads: 17
SMD: 4.3×4.3
Boards: 1

W-PDFN-8-1EP_6x5mm_P1.27mm_EP3x3mm

FP3D

Package_DFN_QFN

W-PDFN, 8 Pin (https://www.mouser.com/datasheet/2/671/mt25q_qljs_u_256_aba_0-3178731.pdf#page=22)

Pads: 9
SMD: 7.3×5.5
Boards: 1

WCH_QFN-16-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

WCH QFN, 16 Pin (https://www.wch.cn/downloads/PACKAGE_PDF.html)

Pads: 17
SMD: 4.3×4.3
Boards: 1

WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm

FP—

Package_DFN_QFN

WDFN, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf)

Pads: 11
SMD: 4.2×3.5
Boards: 1

Texas_DSC0010J_ThermalVias

FP—

Package_SON

3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 1

Texas_S-PWSON-N10

FP—

Package_SON

3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf

Pads: 11
SMD: 4.3×4.1
Boards: 1

WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm_ThermalVias

FP—

Package_SON

WSON, 12 Pin (https://www.ti.com/lit/ds/symlink/tps63710.pdf#page=33)

Pads: 13
SMD: 4.3×3.5
Boards: 1

InvenSense_QFN-24_3x3mm_P0.4mm_NoMask

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 1