Footprints

1,225 footprints matching “6mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,225 footprints · page 6 of 52

Matched by name and keywords. Search by meaning instead

JST_VH_B3P-VH-B_1x03_P3.96mm_Vertical

FP—

Connector_JST

JST VH PBT series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads
3
THT
12.8×9.5
Boards
20

WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm

FP—

Package_SON

WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))

Pads
9
SMD
8.7×6.5
Boards
20

TerminalBlock_Phoenix_PT-1,5-4-3.5-H_1x04_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-4-3.5-H, 4 pins, pitch 3.5mm, size 14x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads
4
THT
15.0×8.6
Boards
20

CP_Axial_L11.0mm_D6.0mm_P18.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=18mm, length*diameter=11*6mm^2, Electrolytic Capacitor

Pads
2
THT
20.9×6.5
Boards
19

QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP—

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)

Pads
21
SMD
5.2×5.2
Boards
19

C_Rect_L13.0mm_W6.0mm_P10.00mm_FKS3_FKP3_MKS4

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=10.00mm, length*width=13*6mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf, http://www.wima.com/EN/WIMA_MKS_4.pdf

Pads
2
THT
13.5×6.5
Boards
18

C_Rect_L4.6mm_W3.0mm_P2.50mm_MKS02_FKP02

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=2.50mm, length*width=4.6*3.0mm^2, Capacitor, http://www.wima.de/DE/WIMA_MKS_02.pdf

Pads
2
THT
5.1×3.5
Boards
18

JST_VH_B3P-VH_1x03_P3.96mm_Vertical

FP—

Connector_JST

JST VH series connector, B3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf)

Pads
3
THT
12.8×9.5
Boards
18

PinHeader_2x17_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 2x17, 2.54mm pitch, 6mm pin length, double rows

Pads
34
THT
14.9×44.2
Boards
18

SolderWire-0.1sqmm_1x04_P3.6mm_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
13.4×2.6
Boards
18

L_Axial_L6.6mm_D2.7mm_P10.16mm_Horizontal_Vishay_IM-2

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=6.6*2.7mm^2, Vishay, IM-2, http://www.vishay.com/docs/34030/im.pdf

Pads
2
THT
12.3×3.2
Boards
18

L_Axial_L7.0mm_D3.3mm_P10.16mm_Horizontal_Fastron_MICC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=7*3.3mm^2, Fastron, MICC, http://www.fastrongroup.com/image-show/70/MICC.pdf?type=Complete-DataSheet&productType=series

Pads
2
THT
12.3×3.8
Boards
18

L_Radial_D6.0mm_P4.00mm

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=4.00mm, diameter=6.0mm, height=4.6mm, http://www.abracon.com/Magnetics/radial/AIUR-07.pdf

Pads
2
THT
7.0×7.0
Boards
18

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads
41
SMD
6.2×6.2
Boards
18

KiCad-Logo_6mm_SilkScreen

FP—

Symbol

KiCad Logo

Pads
—
Mount
exclude_from_pos_files
Boards
18

C_Radial_D10.0mm_H16.0mm_P5.00mm

FP3D

Capacitor_THT

C, Radial series, Radial, pin pitch=5.00mm, diameter=10mm, height=16mm, Non-Polar Electrolytic Capacitor

Pads
2
THT
10.5×10.5
Boards
17

Crystal_SMD_SeikoEpson_FA128-4Pin_2.0x1.6mm

FP—

Crystal

crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en), 2x1.6mm^2 package

Pads
4
SMD
3.0×2.6
Boards
17

QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)

Pads
49
SMD
7.2×7.2
Boards
17

DIP-8_W10.16mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads
8
THT
12.3×10.7
Boards
17

TerminalBlock_Phoenix_MKDS-1,5-6_1x06_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-6, 6 pins, pitch 5mm, size 30x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads
6
THT
31.0×10.8
Boards
17

PinHeader_2x01_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 2x01, 2.54mm pitch, 6mm pin length, double rows

Pads
2
THT
14.9×3.5
Boards
16

PinHeader_2x16_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 2x16, 2.54mm pitch, 6mm pin length, double rows

Pads
32
THT
14.9×41.6
Boards
16

Polarity_Center_Positive_6mm_SilkScreen

FP—

Symbol

Polarity Logo, Center Positive

Pads
—
Mount
exclude_from_pos_files
Boards
16

SolderWire-2.5sqmm_1x01_D2.4mm_OD3.6mm

FP—

Connector_Wire

Soldered wire connection, for a single 2.5 mm² wire, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
1
THT
5.1×5.0
Boards
15