Footprints
3,181 footprints matching “Package”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-20_W7.62mm_LongPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 20
- THT
- 10.5×25.9
- Boards
- 84
USON-10_2.5x1.0mm_P0.5mm
Package_SON
USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf
- Pads
- 10
- SMD
- 1.8×3.0
- Boards
- 84
QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm
Package_DFN_QFN
QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)
- Pads
- 21
- SMD
- 4.3×4.3
- Boards
- 83
DIP-32_W15.24mm
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 32
- THT
- 17.3×41.2
- Boards
- 82
DIP-24_W15.24mm
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 24
- THT
- 17.3×31.0
- Boards
- 80
SSOP-20_5.3x7.2mm_P0.65mm
Package_SO
SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)
- Pads
- 20
- SMD
- 9.4×7.7
- Boards
- 77
DIP-28_W7.62mm_Socket
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 75
DIP-32_W15.24mm_Socket
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 32
- THT
- 18.3×41.3
- Boards
- 75
SOT-89-3_Handsoldering
Package_TO_SOT_SMD
SOT-89-3 Handsoldering
- Pads
- 3
- SMD
- 7.1×5.0
- Boards
- 75
SOT-523
Package_TO_SOT_SMD
SOT523, https://www.diodes.com/assets/Package-Files/SOT523.pdf
- Pads
- 3
- SMD
- 2.3×2.1
- Boards
- 74
InvenSense_QFN-24_3x3mm_P0.4mm
Sensor_Motion
24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 4.1×4.1
- Boards
- 74
QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 72
SOT-583-8
Package_TO_SOT_SMD
https://www.ti.com/lit/ds/symlink/tps62933.pdf
- Pads
- 8
- SMD
- 2.6×2.6
- Boards
- 71
TDSON-8-1
Package_TO_SOT_SMD
Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/)
- Pads
- 5
- SMD
- 7.2×5.7
- Boards
- 70
TSOP-6_1.65x3.05mm_P0.95mm
Package_SO
TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 6
- SMD
- 3.5×3.5
- Boards
- 69
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))
- Pads
- 9
- SMD
- 6.7×5.5
- Boards
- 68
Crystal_SMD_5032-2Pin_5.0x3.2mm_HandSoldering
Crystal
SMD2520/2, Crystal, 5.0x3.2mm package, SMD, hand-soldering, http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf
- Pads
- 2
- SMD
- 9.2×4.2
- Boards
- 66
TO-92_Wide
Package_TO_SOT_THT
TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 7.1×5.6
- Boards
- 66
SOIC-16_4.55x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12858&prodName=TLP291-4)
- Pads
- 16
- SMD
- 8.6×10.8
- Boards
- 64
SOT-23W
Package_TO_SOT_SMD
SOT-23W http://www.allegromicro.com/~/media/Files/Datasheets/A112x-Datasheet.ashx?la=en&hash=7BC461E058CC246E0BAB62433B2F1ECA104CA9D3
- Pads
- 3
- SMD
- 3.9×3.5
- Boards
- 64
TSOT-23-6_HandSoldering
Package_TO_SOT_SMD
6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf
- Pads
- 6
- SMD
- 5.9×3.4
- Boards
- 64
DIP-24_W15.24mm_Socket
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 24
- THT
- 18.3×31.1
- Boards
- 63
LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y
Package_LGA
LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 61
Bosch_LGA-14_3x2.5mm_P0.5mm
Package_LGA
LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf
- Pads
- 14
- SMD
- 3.7×3.2
- Boards
- 60