Footprints

665 footprints matching “Wire”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

665 footprints · page 6 of 28

Matched by name and keywords. Search by meaning instead

SolderWire-6sqmm_1x01_D3.5mm_OD7mm

FP—

Connector_Wire

Soldered wire connection, for a single 6 mm² wire, reinforced insulation, conductor diameter 3.5mm, outer diameter 7mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
1
THT
8.5×8.0
Boards
2

SolderWirePad_1x01_SMD_2x4mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 2mm x 4mm

Pads
1
SMD
2.5×4.5
Boards
2

L_APV_ANR3015

FP3D

Inductor_SMD

Inductor, APV, ANR3015, 3.0x3.0x1.5mm, (http://en.apvind.com/public/upload/20240407/3375c395e460caa8519b4d637d9113ce.pdf)

Pads
2
SMD
3.6×3.5
Boards
2

L_APV_ANR4012

FP3D

Inductor_SMD

Inductor, APV, ANR4012, 4.0x4.0x1.2mm, (http://en.apvind.com/public/upload/20240407/3375c395e460caa8519b4d637d9113ce.pdf)

Pads
2
SMD
4.6×4.5
Boards
2

L_Changjiang_FNR3010S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR3010S, 3.0x3.0x1.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
3.6×3.5
Boards
2

L_Changjiang_FNR8065S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR8065S, 8.0x8.0x6.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
8.7×8.5
Boards
2

L_Wuerth_HCI-7030

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-7030, 6.9x6.9x3.0mm, (https://www.we-online.com/components/products/datasheet/744310013.pdf)

Pads
2
SMD
8.3×7.4
Boards
2

L_Wuerth_HCI-7040

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-7040, 6.9x6.9x3.8mm, (https://www.we-online.com/components/products/datasheet/744311022.pdf)

Pads
2
SMD
8.3×7.4
Boards
2

TestPoint_Loop_D3.80mm_Drill2.5mm

FP3D

TestPoint

wire loop as test point, loop diameter 3.8mm, hole diameter 2.5mm

Pads
1
THT
5.0×5.0
Boards
2

SMA_BAT_Wireless_BWSMA-KWE-Z001

FP—

Connector_Coaxial

BAT Wireless BWSMA-KWE-Z00 https://www.lcsc.com/datasheet/lcsc_datasheet_2310171703_BAT-WIRELESS-BWSMA-KWE-Z001_C496551.pdf

Pads
2
THT
8.3×16.1
Boards
1

Molex_Micro-Latch_53253-0370_1x03_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0370 (compatible alternatives: 53253-0350), 3 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
3
THT
9.0×4.7
Boards
1

Molex_Micro-Latch_53253-0670_1x06_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0670 (compatible alternatives: 53253-0650), 6 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
6
THT
15.0×4.7
Boards
1

Molex_Micro-Latch_53253-0970_1x09_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-0970 (compatible alternatives: 53253-0950), 9 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
9
THT
21.0×4.7
Boards
1

Molex_Micro-Latch_53253-1270_1x12_P2.00mm_Vertical

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53253-1270 (compatible alternatives: 53253-1250), 12 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
12
THT
27.0×4.7
Boards
1

Molex_Micro-Latch_53254-0270_1x02_P2.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53254-0270 (compatible alternatives: 53254-0250), 2 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
2
THT
7.0×8.3
Boards
1

Molex_Micro-Latch_53254-0770_1x07_P2.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Latch Wire-to-Board Connector System, 53254-0770 (compatible alternatives: 53254-0750), 7 Pins per row (http://www.molex.com/pdm_docs/sd/532530770_sd.pdf)

Pads
7
THT
17.0×8.3
Boards
1

Molex_MicroClasp_55932-0230_1x02_P2.00mm_Vertical

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55932-0230, 2 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf)

Pads
2
THT
9.0×7.7
Boards
1

Molex_MicroClasp_55932-0410_1x04_P2.00mm_Vertical

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 4 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf)

Pads
4
THT
13.0×7.7
Boards
1

Molex_MicroClasp_55932-0810_1x08_P2.00mm_Vertical

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55932-0810, with PCB locator, 8 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf)

Pads
8
THT
21.0×7.7
Boards
1

Molex_MicroClasp_55935-0410_1x04_P2.00mm_Horizontal

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB locator, 4 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf)

Pads
4
THT
13.0×12.8
Boards
1

Molex_MicroClasp_55935-0610_1x06_P2.00mm_Horizontal

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55935-0610, with PCB locator, 6 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf)

Pads
6
THT
17.0×12.8
Boards
1

Molex_MicroClasp_55935-0810_1x08_P2.00mm_Horizontal

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55935-0810, with PCB locator, 8 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf)

Pads
8
THT
21.0×12.8
Boards
1

Molex_MicroClasp_55935-1010_1x10_P2.00mm_Horizontal

FP—

Connector_Molex

Molex MicroClasp Wire-to-Board System, 55935-1010, with PCB locator, 10 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf)

Pads
10
THT
25.0×12.8
Boards
1

TE_440054-2_1x02_P2.00mm_Vertical

FP3D

Connector_TE-Connectivity

TE Connectivity, HDI, Wire-to-Board, Fully Shrouded, Vertical Header: https://www.te.com/usa-en/product-440054-2.datasheet.pdf

Pads
2
THT
7.0×5.7
Boards
1