Footprints
129 footprints matching “XP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm_ThermalVias
Package_DFN_QFN
VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)
- Pads
- 57
- SMD
- 9.2×9.2
- Boards
- —
VQFN-56-1EP_8x8mm_P0.5mm_EP5.5x5.06mm
Package_DFN_QFN
VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21_DD_SC.pdf)
- Pads
- 57
- SMD
- 9.2×9.2
- Boards
- —
VQFN-56-1EP_8x8mm_P0.5mm_EP5.5x5.06mm_ThermalVias
Package_DFN_QFN
VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21_DD_SC.pdf)
- Pads
- 57
- SMD
- 9.2×9.2
- Boards
- —
NXP_USON-8_1x1.35mm_P0.35mm
Package_LGA
NXP USON, 8 Pin (https://www.nxp.com/docs/en/package-information/SOT1203.pdf)
- Pads
- 8
- SMD
- 1.7×1.9
- Boards
- —
TQFP-80_14x14mm_P0.65mm
Package_QFP
TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)
- Pads
- 80
- SMD
- 17.3×17.3
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
Nexperia_HUSON-12_USON-12-1EP_1.35x2.5mm_P0.4mm_EP0.4x2mm
Package_SON
Nexperia HUSON-12 USON, 12 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 13
- SMD
- 2.6×3.0
- Boards
- —
Nexperia_HUSON-8_USON-8-1EP_1.35x1.7mm_P0.4mm_EP0.4x1.2mm
Package_SON
Nexperia HUSON-8 USON, 8 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 9
- SMD
- 2.6×2.2
- Boards
- —
