Footprints
2,819 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 23
QFN-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm
Package_DFN_QFN
QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20)
- Pads
- 49
- SMD
- 7.3×7.3
- Boards
- 22
VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 22
DIP-24_W15.24mm_Socket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 24
- THT
- 18.3×31.1
- Boards
- 22
Diodes_SO-8EP
Package_SO
8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)
- Pads
- 9
- SMD
- 7.0×5.1
- Boards
- 22
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 21
DIP-6_W8.89mm_SMDSocket_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 6
- SMD
- 12.5×8.2
- Boards
- 21
Fuse_BelFuse_0ZRE0005FF_L8.3mm_W3.8mm
Fuse
Fuse 0ZRE0005FF, BelFuse, Radial Leaded PTC, https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 8.8×4.3
- Boards
- 20
QFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
QFN, 16 Pin (https://www.onsemi.com/pub/Collateral/NCN4555-D.PDF)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- 20
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
VQFN-32-1EP_5x5mm_P0.5mm_EP3.5x3.5mm
Package_DFN_QFN
VQFN, 32 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT4222H.pdf#page=40)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 20
SMDIP-8_W9.53mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 8
- SMD
- 12.0×10.7
- Boards
- 20
WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))
- Pads
- 9
- SMD
- 8.7×6.5
- Boards
- 20
Diode_Bridge_DIP-4_W7.62mm_P5.08mm
Diode_THT
4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf
- Pads
- 4
- THT
- 9.7×8.9
- Boards
- 19
Diode_Bridge_Round_D9.0mm
Diode_THT
4-lead round diode bridge package, diameter 9.0mm, pin pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf
- Pads
- 4
- THT
- 10.6×10.6
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm
Package_DFN_QFN
DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- 19
QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 19
QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 19
DIP-4_W7.62mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 4
- THT
- 10.5×5.6
- Boards
- 19
DIP-48_W15.24mm_Socket
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 48
- THT
- 18.3×61.6
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 18
QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm
Package_DFN_QFN
QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- 18