Footprints

1,145 footprints matching “0.5MM”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,145 footprints · page 7 of 48

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Texas_USON-6_1x1.45mm_P0.5mm_SMD

FP3D

Package_SON

USON, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined

Pads: 6
SMD: 1.5×2.0
Boards: 8

TE_0-1734839-8_1x08-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 08 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads: 9
SMD: 10.4×6.7
Boards: 7

SolderWire-0.5sqmm_1x02_P4.6mm_D0.9mm_OD2.1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 8.2×16.0
Boards: 7

SolderWire-0.5sqmm_1x02_P4.8mm_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 2
THT: 8.6×3.3
Boards: 7

L_Radial_D10.5mm_P5.00mm_Abacron_AISR-01

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=5.00mm, diameter=10.5mm, height=10.5mm, Abacron, AISR-01, http://www.abracon.com/Magnetics/radial/AISR-01.pdf

Pads: 2
THT: 11.0×11.0
Boards: 7

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias

FP—

Package_DFN_QFN

HVQFN, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 7

QFN-24-1EP_4x4mm_P0.5mm_EP2.75x2.75mm

FP—

Package_DFN_QFN

QFN, 24 Pin (https://www.infineon.com/dgdl/Infineon-EZ-PD_BCR_Datasheet_USB_Type-C_Port_Controller_for_Power_Sinks-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ce9d70ad)

Pads: 25
SMD: 5.3×5.3
Boards: 7

QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)

Pads: 33
SMD: 6.3×6.3
Boards: 7

QFN-64-1EP_9x9mm_P0.5mm_EP7.65x7.65mm

FP—

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-2549-8-bit-AVR-Microcontroller-ATmega640-1280-1281-2560-2561_datasheet.pdf (page 415))

Pads: 65
SMD: 10.3×10.3
Boards: 7

Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)

Pads: 25
SMD: 5.3×5.3
Boards: 7

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 7

VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP—

Package_DFN_QFN

VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 7

WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)

Pads: 17
SMD: 4.3×4.3
Boards: 7

LQFP-32_5x5mm_P0.5mm

FP3D

Package_QFP

LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT401-1.pdf)

Pads: 32
SMD: 8.4×8.4
Boards: 7

Texas_S-PVSON-N10

FP3D

Package_SON

3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 7

WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias

FP3D

Package_SON

WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)

Pads: 11
SMD: 3.8×3.0
Boards: 7

WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias

FP3D

Package_SON

WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)

Pads: 11
SMD: 3.3×3.5
Boards: 7

C_Disc_D10.5mm_W5.0mm_P7.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=7.50mm, diameter*width=10.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads: 2
THT: 11.0×5.5
Boards: 6

TE_1-1734839-6_1x16-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 16 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads: 17
SMD: 14.4×6.7
Boards: 6

SolderWire-0.5sqmm_1x03_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 3
THT: 12.8×3.2
Boards: 6

SolderWire-0.5sqmm_1x04_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 4
THT: 17.4×3.2
Boards: 6