Footprints

1,701 footprints matching “7mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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1,701 footprints · page 7 of 71

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SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads: 8
SMD: 13.0×6.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

L_Radial_D7.0mm_P3.00mm

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=3.00mm, diameter=7mm, height=9.5mm, http://www.abracon.com/Magnetics/radial/AIUR-16.pdf

Pads: 2
THT: 7.5×7.5
Boards: 16

MountingHole_2.7mm_M2.5_Pad_TopBottom

FP—

MountingHole

Mounting Hole 2.7mm, M2.5, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 5.9×5.9
Boards: 16

QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)

Pads: 21
SMD: 5.2×5.2
Boards: 16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

SolderWire-1.5sqmm_1x01_D1.7mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for a single 1.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 5.4×4.9
Boards: 15

LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm

FP3D

Package_QFP

LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: 15

SOIC-4_4.55x2.6mm_P1.27mm

FP—

Package_SO

SOIC, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291)

Pads: 4
SMD: 8.6×3.1
Boards: 15

SW_DIP_SPSTx04_Slide_Copal_CHS-04B_W7.62mm_P1.27mm

FP3D

Button_Switch_SMD

SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD

Pads: 8
SMD: 9.7×7.0
Boards: 14

PinHeader_2x10_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 2x10, 1.27mm pitch, double rows

Pads: 20
THT: 4.4×13.7
Boards: 14

SolderWire-1sqmm_1x02_P5.4mm_D1.4mm_OD2.7mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 1 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 1.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 9.6×3.8
Boards: 14

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

TerminalBlock_4Ucon_1x03_P3.50mm_Horizontal

FP—

TerminalBlock_4Ucon

Terminal Block 4Ucon ItemNo. 20193, 3 pins, pitch 3.5mm, size 11.2x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/20193.pdf

Pads: 3
THT: 12.2×8.0
Boards: 14

TerminalBlock_4Ucon_1x04_P3.50mm_Horizontal

FP—

TerminalBlock_4Ucon

Terminal Block 4Ucon ItemNo. 20001, 4 pins, pitch 3.5mm, size 14.7x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/20001.pdf

Pads: 4
THT: 15.7×8.0
Boards: 14

SW_DIP_SPSTx02_Slide_Copal_CHS-02B_W7.62mm_P1.27mm

FP3D

Button_Switch_SMD

SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD

Pads: 4
SMD: 9.7×4.4
Boards: 13

PinHeader_1x07_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 1x07, 1.27mm pitch, single row

Pads: 7
THT: 3.1×9.9
Boards: 13

PinHeader_2x04_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 2x04, 1.27mm pitch, double rows

Pads: 8
THT: 4.4×6.1
Boards: 13

PinSocket_1x06_P1.27mm_Vertical

FP3D

Connector_PinSocket_1.27mm

Through hole straight socket strip, 1x06, 1.27mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 6
THT: 3.5×8.6
Boards: 13

SolderWire-1.5sqmm_1x02_P6mm_D1.7mm_OD3mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 10.5×4.2
Boards: 13

L_Axial_L9.5mm_D4.0mm_P12.70mm_Horizontal_Fastron_SMCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=12.7mm, length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf

Pads: 2
THT: 15.2×4.5
Boards: 13