Footprints

167 footprints matching “Plastic”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

167 footprints · page 7 of 7

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DFN-32-1EP_4x7mm_P0.4mm_EP2.64x6.44mm

FP3D

Package_DFN_QFN

DKD Package; 32-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf)

Pads: 33
SMD: 5.0×7.6
Boards: —

DFN-8-1EP_3x2mm_P0.45mm_EP1.66x1.36mm

FP3D

Package_DFN_QFN

DCB Package 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf)

Pads: 9
SMD: 4.0×2.6
Boards: —

OnSemi_UDFN-8_1.2x1.8mm_P0.4mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF)

Pads: 8
SMD: 2.0×2.3
Boards: —

OnSemi_XDFN-10_1.35x2.2mm_P0.4mm

FP—

Package_DFN_QFN

10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf)

Pads: 10
SMD: 2.0×2.8
Boards: —

QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm

FP—

Package_DFN_QFN

44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN]; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf

Pads: 45
SMD: 9.7×9.7
Boards: —

QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm_ThermalVias

FP—

Package_DFN_QFN

44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN] with thermal vias; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf

Pads: 45
SMD: 9.7×9.7
Boards: —

QFN-64-1EP_9x9mm_P0.5mm_EP7.25x7.25mm

FP—

Package_DFN_QFN

64-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826)

Pads: 65
SMD: 10.3×10.3
Boards: —

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: —

Texas_S-PWQFN-N20

FP3D

Package_DFN_QFN

20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)

Pads: 20
SMD: 3.9×3.9
Boards: —

UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: —

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

PowerIntegrations_SO-8B

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: —

PSOP-44_16.9x27.17mm_P1.27mm

FP3D

Package_SO

PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm

Pads: 44
SMD: 19.2×28.8
Boards: —

SSO-8_13.6x6.3mm_P1.27mm_Clearance14.2mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 8
SMD: 18.4×6.7
Boards: —

SSO-8_9.6x6.3mm_P1.27mm_Clearance10.5mm

FP3D

Package_SO

Pads: 8
SMD: 14.9×6.7
Boards: —

VSO-40_7.6x15.4mm_P0.762mm

FP3D

Package_SO

VSO40: plastic very small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf)

Pads: 40
SMD: 13.1×16.1
Boards: —

VSO-56_11.1x21.5mm_P0.75mm

FP3D

Package_SO

VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)

Pads: 56
SMD: 16.6×22.2
Boards: —

SOD-70_P2.54mm

FP3D

Package_TO_SOT_THT

Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint]

Pads: 2
THT: 5.1×4.3
Boards: —

SOD-70_P5.08mm

FP3D

Package_TO_SOT_THT

Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint]

Pads: 2
THT: 6.8×4.3
Boards: —

Allegro_QSOP-24_3.9x8.7mm_P0.635mm

FP3D

Sensor_Current

Allegro Microsystems 24-Lead Plastic Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en)

Pads: 24
SMD: 7.8×9.2
Boards: —

InvenSense_QFN-24_4x4mm_P0.5mm_NoMask

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: —