Footprints

12,747 footprints matching “d”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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12,747 footprints · page 7 of 532

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DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

C_1210_3225Metric_Pad1.33x2.70mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads: 2
SMD: 5.0×3.2
Boards: 241

PinHeader_2x10_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x10, 2.54mm pitch, double rows

Pads: 20
THT: 6.1×26.4
Boards: 240

R_Axial_DIN0309_L9.0mm_D3.2mm_P12.70mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=12.7mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 14.8×3.7
Boards: 230

PinHeader_1x20_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x20, 2.54mm pitch, single row

Pads: 20
THT: 3.5×51.8
Boards: 227

D_DO-41_SOD81_P7.62mm_Horizontal

FP3D

Diode_THT

Diode, DO-41_SOD81 series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.2*2.7mm^2, https://www.diodes.com/assets/Package-Files/DO-41-Plastic.pdf

Pads: 2
THT: 10.3×3.2
Boards: 227

SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm

FP—

Jumper

SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip

Pads: 2
SMD: 3.3×2.5
Boards: 227

DIP-20_W7.62mm_Socket

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 20
THT: 10.7×26.0
Boards: 227

Crystal_SMD_HC49-SD

FP3D

Crystal

HC-49-SD, Crystal, 11.4x4.7mm package, SMD, http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf

Pads: 2
SMD: 13.5×5.7
Boards: 225

DIP-14_W7.62mm_Socket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

TerminalBlock_Phoenix_MKDS-1,5-2_1x02_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-2, 2 pins, pitch 5mm, size 10x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 2
THT: 11.0×10.8
Boards: 223

SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm

FP—

Jumper

SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip

Pads: 3
SMD: 4.6×2.5
Boards: 222

SW_Push_SPST_NO_Alps_SKRK

FP3D

Button_Switch_SMD

http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKRK/SKRKAHE020.html

Pads: 2
SMD: 5.5×3.4
Boards: 221

D_SOD-323F

FP3D

Diode_SMD

SOD-323F http://www.nxp.com/documents/outline_drawing/SOD323F.pdf

Pads: 2
SMD: 3.2×1.9
Boards: 221

L_1008_2520Metric

FP3D

Inductor_SMD

Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf)

Pads: 2
SMD: 3.9×2.7
Boards: 218

TO-263-5_TabPin3

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/

Pads: 5
SMD: 16.6×11.3
Boards: 217

CP_Radial_D4.0mm_P1.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=1.50mm, diameter=4mm, height=7mm, Electrolytic Capacitor

Pads: 2
THT: 4.5×4.5
Boards: 209

DIP-14_W7.62mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

TestPoint_THTPad_D1.0mm_Drill0.5mm

FP—

TestPoint

THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm

Pads: 1
THT: 2.0×2.0
Boards: 204

IDC-Header_2x03_P2.54mm_Vertical

FP3D

Connector_IDC

Through hole IDC box header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0

Pads: 6
THT: 9.9×16.3
Boards: 203