Footprints

1,939 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,939 footprints · page 7 of 81

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VSONP-8-1EP_5x6_P1.27mm

FP—

Package_SON

SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf)

Pads: 3
SMD: 6.8×5.4
Boards: 7

TO-92-2

FP3D

Package_TO_SOT_THT

TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.5×4.7
Boards: 7

Fuse_BelFuse_0ZRE0016FF_L9.9mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0016FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 10.4×4.3
Boards: 6

Fuse_BelFuse_0ZRE0025FF_L9.6mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0025FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 10.1×4.3
Boards: 6

Fuse_BelFuse_0ZRE0033FF_L11.4mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0033FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 11.9×4.3
Boards: 6

Oscillator_SeikoEpson_SG-8002DC

FP3D

Oscillator

8-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 4
THT: 9.8×14.0
Boards: 6

ST_UFQFPN-20_3x3mm_P0.5mm

FP—

Package_DFN_QFN

UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)

Pads: 20
SMD: 3.5×3.5
Boards: 6

DIP-4_W7.62mm_Socket

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 4
THT: 10.7×5.7
Boards: 6

DIP-6_W10.16mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 6
THT: 12.3×8.1
Boards: 6

DIP-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 6
SMD: 10.7×8.2
Boards: 6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-6_W9.53mm_Clearance8mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 6
SMD: 11.5×8.1
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

Diode_Bridge_Round_D8.9mm

FP3D

Diode_THT

4-lead round diode bridge package, diameter 8.9mm, pin pitch 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF

Pads: 4
THT: 8.4×9.3
Boards: 5

DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)

Pads: 13
SMD: 4.1×4.6
Boards: 5

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 5

DIP-14_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 14
SMD: 10.7×18.4
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

PLCC-20_THT-Socket

FP—

Package_LCC

PLCC, 20 pins, through hole

Pads: 20
THT: 16.5×16.5
Boards: 5

PLCC-52_THT-Socket

FP—

Package_LCC

PLCC, 52 pins, through hole

Pads: 52
THT: 26.8×26.8
Boards: 5

TSOC-6_3.76x3.94mm_P1.27mm

FP—

Package_SO_J-Lead

Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF

Pads: 6
SMD: 4.9×4.4
Boards: 5

SO-4_4.4x2.3mm_P1.27mm

FP3D

Package_SO

4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf

Pads: 4
SMD: 8.8×2.9
Boards: 5