Footprints
1,939 footprints matching “leaded”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Infineon_PQFN-44-31-5EP_7x7mm_P0.5mm
Package_DFN_QFN
PQFN 44 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134)
- Pads
- 27
- SMD
- 8.1×8.1
- Boards
- —
Microchip_8E-16
Package_DFN_QFN
16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.0×5.0
- Boards
- —
OnSemi_UDFN-8_1.2x1.8mm_P0.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF)
- Pads
- 8
- SMD
- 2.0×2.3
- Boards
- —
OnSemi_XDFN-10_1.35x2.2mm_P0.4mm
Package_DFN_QFN
10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf)
- Pads
- 10
- SMD
- 2.0×2.8
- Boards
- —
QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm
Package_DFN_QFN
44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN]; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf
- Pads
- 45
- SMD
- 9.7×9.7
- Boards
- —
QFN-44-1EP_9x9mm_P0.65mm_EP7.5x7.5mm_ThermalVias
Package_DFN_QFN
44-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [QFN] with thermal vias; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf
- Pads
- 45
- SMD
- 9.7×9.7
- Boards
- —
QFN-64-1EP_9x9mm_P0.5mm_EP7.25x7.25mm
Package_DFN_QFN
64-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- —
TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias
Package_DFN_QFN
8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- —
Texas_RPU0010A_VQFN-HR-10_2x2mm_P0.5mm
Package_DFN_QFN
VQFN-HR, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62912.pdf#page=39)
- Pads
- 10
- SMD
- 2.9×2.7
- Boards
- —
Texas_S-PWQFN-N20
Package_DFN_QFN
20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)
- Pads
- 20
- SMD
- 3.9×3.9
- Boards
- —
UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
CERDIP-14_W7.62mm_SideBrazed_Socket
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.7×19.7
- Boards
- —
CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_LongPads
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.5×23.4
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_Socket
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- —
CERDIP-20_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 20
- THT
- 10.7×26.0
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 9.7×28.4
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_LongPads
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.5×28.4
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_Socket
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 9.7×31.0
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed_LongPads
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 10.5×31.0
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- —
