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1,969 footprints matching “54mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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1,969 footprints · page 76 of 83

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DIP-8-16_W7.62mm_Socket

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
8
THT
10.7×25.9
Boards
—

DIP-8-16_W7.62mm_Socket_LongPads

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
8
THT
10.7×25.9
Boards
—

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads
7
THT
9.8×10.7
Boards
—

Fairchild_LSOP-8

FP—

Package_DIP

8-lead, 300 mils wide, surface mount package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf)

Pads
8
SMD
11.2×10.2
Boards
—

IXYS_Flatpak-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads
8
SMD
10.8×10.2
Boards
—

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads
8
SMD
11.1×10.2
Boards
—

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads
11
THT
12.1×10.8
Boards
—

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads
7
THT
10.6×10.7
Boards
—

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads
7
THT
10.6×10.7
Boards
—

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads
9
THT
10.6×13.3
Boards
—

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads
7
SMD
11.1×10.7
Boards
—

SMDIP-10_W11.48mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
10
SMD
14.0×13.2
Boards
—

SMDIP-10_W7.62mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
10
SMD
10.1×13.2
Boards
—

SMDIP-10_W9.53mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
10
SMD
12.0×13.2
Boards
—

SMDIP-10_W9.53mm_Clearance8mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
10
SMD
11.5×13.2
Boards
—

SMDIP-12_W11.48mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
12
SMD
14.0×15.7
Boards
—

SMDIP-12_W7.62mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
12
SMD
10.1×15.7
Boards
—

SMDIP-12_W9.53mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
12
SMD
12.0×15.7
Boards
—

SMDIP-12_W9.53mm_Clearance8mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
12
SMD
11.5×15.7
Boards
—

SMDIP-14_W11.48mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
14
SMD
14.0×18.3
Boards
—

SMDIP-14_W7.62mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
14
SMD
10.1×18.3
Boards
—

SMDIP-14_W9.53mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
14
SMD
12.0×18.3
Boards
—

SMDIP-14_W9.53mm_Clearance8mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
14
SMD
11.5×18.3
Boards
—

SMDIP-16_W11.48mm

FP3D

Package_DIP

16-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
16
SMD
14.0×20.8
Boards
—