Footprints
1,347 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LQFP-80_12x12mm_P0.5mm
Package_QFP
LQFP, 80 Pin (https://www.nxp.com/docs/en/package-information/SOT315-1.pdf)
- Pads
- 80
- SMD
- 15.4×15.4
- Boards
- 8
TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 8
MSOP-10-1EP_3x3mm_P0.5mm_EP1.73x1.98mm
Package_SO
MSOP, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 8
TSSOP-38_4.4x9.7mm_P0.5mm
Package_SO
TSSOP, 38 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 38
- SMD
- 7.7×10.2
- Boards
- 8
Texas_USON-6_1x1.45mm_P0.5mm_SMD
Package_SON
USON, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined
- Pads
- 6
- SMD
- 1.5×2.0
- Boards
- 8
TE_0-1734839-8_1x08-1MP_P0.5mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 08 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0
- Pads
- 9
- SMD
- 10.4×6.7
- Boards
- 7
SolderWire-0.5sqmm_1x02_P4.6mm_D0.9mm_OD2.1mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 8.2×16.0
- Boards
- 7
SolderWire-0.5sqmm_1x02_P4.8mm_D0.9mm_OD2.3mm
Connector_Wire
Soldered wire connection, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 8.6×3.3
- Boards
- 7
L_Radial_D10.5mm_P5.00mm_Abacron_AISR-01
Inductor_THT
Inductor, Radial series, Radial, pin pitch=5.00mm, diameter=10.5mm, height=10.5mm, Abacron, AISR-01, http://www.abracon.com/Magnetics/radial/AISR-01.pdf
- Pads
- 2
- THT
- 11.0×11.0
- Boards
- 7
DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 7
HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias
Package_DFN_QFN
HVQFN, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 7
QFN-24-1EP_4x4mm_P0.5mm_EP2.75x2.75mm
Package_DFN_QFN
QFN, 24 Pin (https://www.infineon.com/dgdl/Infineon-EZ-PD_BCR_Datasheet_USB_Type-C_Port_Controller_for_Power_Sinks-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ce9d70ad)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 7
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 7
QFN-64-1EP_9x9mm_P0.5mm_EP7.65x7.65mm
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-2549-8-bit-AVR-Microcontroller-ATmega640-1280-1281-2560-2561_datasheet.pdf (page 415))
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 7
Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm
Package_DFN_QFN
Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 7
VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 7
VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 7
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 7
LQFP-32_5x5mm_P0.5mm
Package_QFP
LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT401-1.pdf)
- Pads
- 32
- SMD
- 8.4×8.4
- Boards
- 7
Texas_S-PVSON-N10
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 7
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 7
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 7
TerminalBlock_MetzConnect_Type059_RT06303HBWC_1x03_P3.50mm_Horizontal
TerminalBlock_MetzConnect
terminal block Metz Connect Type059_RT06303HBWC, 3 pins, pitch 3.5mm, size 10.5x6.5mm, drill diameter 1.2mm, pad diameter 2.3mm, https://www.metz-connect.com/externalfiles/310591/863246.PDF
- Pads
- 3
- THT
- 11.5×7.5
- Boards
- 7
C_01005_0402Metric_Pad0.57x0.30mm_HandSolder
Capacitor_SMD
Capacitor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf)
- Pads
- 2
- SMD
- 1.6×0.6
- Boards
- 6