Footprints
1,509 footprints matching “2mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Axial_L5.3mm_D2.2mm_P2.54mm_Vertical_Vishay_IM-1
Inductor_THT
Inductor, Axial series, Axial, Vertical, pin pitch=2.54mm, length*diameter=5.3*2.2mm^2, Vishay, IM-1, http://www.vishay.com/docs/34030/im.pdf
- Pads
- 2
- THT
- 4.9×2.7
- Boards
- 20
MountingHole_2.2mm_M2_ISO7380_Pad_TopBottom
MountingHole
Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 4.0×4.0
- Boards
- 20
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 20
TerminalBlock_Phoenix_PT-1,5-4-3.5-H_1x04_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-4-3.5-H, 4 pins, pitch 3.5mm, size 14x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 4
- THT
- 15.0×8.6
- Boards
- 20
SW_DIP_SPSTx02_Slide_6.7x6.64mm_W7.62mm_P2.54mm_LowProfile
Button_Switch_THT
2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile
- Pads
- 4
- THT
- 9.7×7.3
- Boards
- 19
SW_DIP_SPSTx04_Slide_6.7x11.72mm_W7.62mm_P2.54mm_LowProfile
Button_Switch_THT
4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile
- Pads
- 8
- THT
- 9.7×12.3
- Boards
- 19
Crystal_SMD_TXC_7A-2Pin_5x3.2mm
Crystal
SMD Crystal TXC 7A http://txccrystal.com/images/pdf/7a.pdf
- Pads
- 2
- SMD
- 5.9×3.7
- Boards
- 19
Diode_Bridge_DIP-4_W7.62mm_P5.08mm
Diode_THT
4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf
- Pads
- 4
- THT
- 9.7×8.9
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm
Package_DFN_QFN
DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- 19
DIP-4_W7.62mm_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 4
- THT
- 10.5×5.6
- Boards
- 19
Crystal_SMD_MicroCrystal_CC8V-T1A-2Pin_2.0x1.2mm
Crystal
MicroCrystal CC8V-T1A/CM8V-T1A, Crystal, 2.0x1.2mm package, SMD, http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf
- Pads
- 2
- SMD
- 3.0×2.2
- Boards
- 18
Crystal_SMD_SeikoEpson_MC306-4Pin_8.0x3.2mm
Crystal
Seiko Epson MC-306, Crystal, 8.0x3.2mm package, SMD, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf
- Pads
- 4
- SMD
- 9.0×5.6
- Boards
- 18
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
ST_HLGA-10_2x2mm_P0.5mm_LayoutBorder3x2y
Package_LGA
ST HLGA, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55)
- Pads
- 10
- SMD
- 2.5×2.5
- Boards
- 18
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 18
WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias
Package_SON
WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf
- Pads
- 13
- SMD
- 2.9×3.5
- Boards
- 18
TestPoint_Bridge_Pitch7.62mm_Drill1.3mm
TestPoint
wire loop as test point, pitch 7.62mm, hole diameter 1.3mm, wire diameter 1.0mm
- Pads
- 1
- THT
- 11.2×3.6
- Boards
- 18
L_12x12mm_H4.5mm
Inductor_SMD
Choke, SMD, 12x12mm 4.5mm height
- Pads
- 2
- SMD
- 13.7×13.2
- Boards
- 17
MountingHole_2.2mm_M2_DIN965_Pad_TopOnly
MountingHole
Mounting Hole 2.2mm, M2, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 4.3×4.3
- Boards
- 17
OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
Package_DFN_QFN
XDFN4 footprint (as found on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF)
- Pads
- 5
- SMD
- 1.7×1.5
- Boards
- 17
QFN-48-1EP_8x8mm_P0.5mm_EP6.2x6.2mm
Package_DFN_QFN
QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49)
- Pads
- 49
- SMD
- 9.2×9.2
- Boards
- 17
DIP-6_W7.62mm_Socket
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 6
- THT
- 10.7×8.2
- Boards
- 17
SO-16_5.3x10.2mm_P1.27mm
Package_SO
SO, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)
- Pads
- 16
- SMD
- 9.4×10.7
- Boards
- 17