Footprints

197 footprints matching “300mil”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

197 footprints · page 8 of 9

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DIP-5-6_W7.62mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads

Pads: 5
THT: 10.6×8.2
Boards: —

DIP-5-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads

Pads: 5
SMD: 10.7×8.3
Boards: —

DIP-5-6_W7.62mm_Socket

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket

Pads: 5
THT: 10.7×8.3
Boards: —

DIP-5-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads

Pads: 5
THT: 10.7×8.3
Boards: —

DIP-8-16_W7.62mm_Socket

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-16_W7.62mm_Socket_LongPads

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×25.9
Boards: —

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads: 7
THT: 9.8×10.7
Boards: —

Fairchild_LSOP-8

FP—

Package_DIP

8-lead, 300 mils wide, surface mount package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf)

Pads: 8
SMD: 11.2×10.2
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —

SMDIP-10_W7.62mm

FP3D

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 10
SMD: 10.1×13.2
Boards: —

SMDIP-12_W7.62mm

FP3D

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 12
SMD: 10.1×15.7
Boards: —

SMDIP-14_W7.62mm

FP3D

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 14
SMD: 10.1×18.3
Boards: —

SMDIP-16_W7.62mm

FP3D

Package_DIP

16-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 16
SMD: 10.1×20.8
Boards: —

SMDIP-18_W7.62mm

FP3D

Package_DIP

18-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 18
SMD: 10.1×23.4
Boards: —

SMDIP-20_W7.62mm

FP3D

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 20
SMD: 10.1×25.9
Boards: —

SMDIP-22_W7.62mm

FP3D

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 22
SMD: 10.1×28.4
Boards: —

SMDIP-24_W7.62mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 24
SMD: 10.1×31.0
Boards: —

SMDIP-32_W7.62mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 32
SMD: 10.1×41.2
Boards: —

Toshiba_11-7A9

FP3D

Package_DIP

Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)

Pads: 5
THT: 9.8×8.2
Boards: —

Relay_StandexMeder_DIP_HighProfile

FP3D

Relay_THT

package for Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf

Pads: 8
THT: 9.8×20.4
Boards: —