Footprints

448 footprints matching “pd”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

448 footprints · page 8 of 19

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SW_XKB_DM1-16UP-1

FP3D

Button_Switch_THT

1A 30V SPDT Micro Switch rated for one million cycles, W12.7xD5.7xH6.6, https://www.helloxkb.com/public/images/pdf/DMX-XXXP-X.pdf

Pads: 3
THT: 18.0×6.4
Boards: 2

CUI_PD-30

FP—

Connector

3 pin connector, PD-30, http://www.cui.com/product/resource/pd-30.pdf

Pads: 4
THT: 15.9×18.0
Boards: 2

Texas_S-PDSO-N10_EP1.2x2mm

FP—

Package_DFN_QFN

DFN, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30)

Pads: 11
SMD: 3.8×3.0
Boards: 2

Texas_S-PDSO-N10_EP1.2x2mm_ThermalVias

FP—

Package_DFN_QFN

DFN, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30)

Pads: 11
SMD: 3.8×3.0
Boards: 2

DIP-14_W10.16mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 14
THT: 13.1×18.3
Boards: 2

DIP-14_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 14
SMD: 12.5×18.4
Boards: 2

DIP-24_W10.16mm_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 24
THT: 13.1×31.0
Boards: 2

DIP-28_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 28
SMD: 10.7×36.2
Boards: 2

DIP-64_W22.86mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads

Pads: 64
THT: 25.8×81.8
Boards: 2

DIP-64_W25.4mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)

Pads: 64
THT: 27.5×81.8
Boards: 2

DIP-64_W25.4mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads

Pads: 64
THT: 28.4×81.9
Boards: 2

DIP-8-16_W7.62mm

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×20.8
Boards: 2

PowerIntegrations_SMD-8B

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
SMD: 11.1×10.7
Boards: 2

SMDIP-8_W11.48mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 8
SMD: 14.0×10.7
Boards: 2

SMDIP-8_W9.53mm_Clearance8mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 8
SMD: 11.5×10.7
Boards: 2

Texas_R-PDSO-N5_DRL-5

FP—

Package_TO_SOT_SMD

R-PDSO-N5, DRL, JEDEC MO-293B Var UAAD-1, https://www.ti.com/lit/ml/mpds158g/mpds158g.pdf

Pads: 5
SMD: 2.7×2.1
Boards: 2

Relay_DPDT_Omron_G6S-2F

FP3D

Relay_SMD

Relay Omron G6S-2F, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf

Pads: 8
SMD: 10.7×15.3
Boards: 2

Relay_SPDT_AXICOM_HF3Series_50ohms_Pitch1.27mm

FP—

Relay_SMD

hiqsdr.com/images/3/3e/Axicom-HF3.pdf

Pads: 16
SMD: 10.6×15.5
Boards: 2

Relay_DPDT_AXICOM_IMSeries_Pitch3.2mm

FP—

Relay_THT

AXICOM IM-Series Relays, DPDR, Pitch 3.2mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Specification+Or+Standard%7F108-98001%7FV%7Fpdf%7FEnglish%7FENG_SS_108-98001_V_IM_0614_v1.pdf%7F4-1462039-1

Pads: 8
THT: 7.0×10.5
Boards: 2

Relay_DPDT_Omron_G6K-2P-Y

FP3D

Relay_THT

Omron G6K-2P-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf

Pads: 8
THT: 7.3×10.5
Boards: 2

Relay_SPDT_Hongfa_JQC-3FF_0XX-1Z

FP—

Relay_THT

Hongfa subminature high power latching SPDT relay 5, 6, 9, 12, 18, 24, 48VDC. 10A switching current, Form-B https://www.generationrobots.com/media/JQC-3FF-v1.pdf

Pads: 5
THT: 19.8×16.2
Boards: 2