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Footprints

261 footprints matching “x8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

261 footprints · page 8 of 11

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Texas_DSBGA-64_3.415x3.535mm_Layout8x8_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads
64
SMD
5.4×5.5
Boards
—

TFBGA-48_6x10mm_Layout6x8_P0.75mm

FP—

Package_BGA

TFBGA-48, NSMD, 6.0x10.0mm, 48 Ball, 6x8 Layout, 0.75mm Pitch, https://www.jedec.org/system/files/docs/MO-207N.pdf

Pads
48
SMD
8.0×12.0
Boards
—

TFBGA-64_5x5mm_Layout8x8_P0.5mm

FP3D

Package_BGA

TFBGA-64, 5.0x5.0mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f100v8.pdf#page=83

Pads
64
SMD
7.0×7.0
Boards
—

ucBGA-64_4x4mm_Layout8x8_P0.4mm

FP3D

Package_BGA

ucBGA-64, 4x4mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213

Pads
64
SMD
6.0×6.0
Boards
—

XFBGA-121_8x8mm_Layout11x11_P0.65mm

FP—

Package_BGA

XFBGA-121, https://www.nxp.com/docs/en/package-information/SOT1533-1.pdf

Pads
121
SMD
10.2×10.2
Boards
—

XFBGA-64_5.0x5.0mm_Layout8x8_P0.5mm

FP—

Package_BGA

XFBGA-64, https://www.nxp.com/docs/en/package-information/SOT1555-1.pdf

Pads
64
SMD
7.0×7.0
Boards
—

Efinix_WLCSP-64_3.5353x3.3753mm_Layout8x8_P0.4mm

FP—

Package_CSP

Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9

Pads
64
SMD
5.5×5.4
Boards
—

Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm

FP—

Package_CSP

WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads
80
SMD
6.5×5.6
Boards
—

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads
57
SMD
9.3×9.3
Boards
—

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads
57
SMD
9.3×9.3
Boards
—

ST_WLCSP-52_3.09x3.15mm_Layout13x8_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136

Pads
52
SMD
5.1×5.2
Boards
—

ST_WLCSP-56_3.38x3.38mm_Layout14x8_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-56, ST die ID 455, 3.38x3.38mm, 56 Ball, X-staggered 14x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf

Pads
56
SMD
5.4×5.4
Boards
—

ST_WLCSP-64_3.56x3.52mm_Layout8x8_P0.4mm

FP—

Package_CSP

ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf

Pads
64
SMD
5.6×5.5
Boards
—

WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm

FP—

Package_CSP

WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf

Pads
56
SMD
5.2×5.5
Boards
—

DFN-44-1EP_5x8.9mm_P0.4mm_EP3.7x8.4mm

FP3D

Package_DFN_QFN

DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506BU.PDF)

Pads
45
SMD
5.8×9.6
Boards
—

Panasonic_HSON-8_8x8mm_P2.00mm

FP—

Package_DFN_QFN

Panasonic HSON-8, 8x8x1.25mm (https://industrial.panasonic.com/content/data/SC/ds/ds7/c0/PKG_HSON008-A-0808XXI_EN.pdf)

Pads
9
SMD
9.5×8.5
Boards
—

QFN-44-1EP_8x8mm_P0.65mm_EP6.45x6.45mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152)

Pads
45
SMD
9.2×9.2
Boards
—

QFN-48-1EP_8x8mm_P0.5mm_EP6.2x6.2mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49)

Pads
49
SMD
9.2×9.2
Boards
—

QFN-52-1EP_7x8mm_P0.5mm_EP5.41x6.45mm

FP3D

Package_DFN_QFN

QFN, 52 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_52_05-08-1729.pdf)

Pads
53
SMD
8.3×9.3
Boards
—

QFN-52-1EP_7x8mm_P0.5mm_EP5.41x6.45mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 52 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_52_05-08-1729.pdf)

Pads
53
SMD
8.3×9.3
Boards
—

QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4)

Pads
57
SMD
9.3×9.3
Boards
—

QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm_ThermalVias_TopTented

FP3D

Package_DFN_QFN

QFN, 56 Pin top tented version (manually modified). For information see: http://www.cypress.com/file/138911/download

Pads
57
SMD
9.2×9.2
Boards
—

QFN-56-1EP_8x8mm_P0.5mm_EP6.1x6.1mm

FP—

Package_DFN_QFN

QFN, 56 Pin (http://intantech.com/files/Intan_RHD2000_series_datasheet.pdf#page=38)

Pads
57
SMD
9.3×9.3
Boards
—

QFN-56-1EP_8x8mm_P0.5mm_EP6.1x6.1mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 56 Pin (http://intantech.com/files/Intan_RHD2000_series_datasheet.pdf#page=38)

Pads
57
SMD
9.3×9.3
Boards
—