Footprints

1,347 footprints matching “0.5”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,347 footprints · page 9 of 57

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C_Disc_D10.5mm_W5.0mm_P7.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=7.50mm, diameter*width=10.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads
2
THT
11.0×5.5
Boards
6

TE_1-1734839-6_1x16-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 16 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads
17
SMD
14.4×6.7
Boards
6

SolderWire-0.5sqmm_1x03_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
3
THT
12.8×3.2
Boards
6

SolderWire-0.5sqmm_1x04_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
17.4×3.2
Boards
6

NetTie-3_SMD_Pad0.5mm

FP—

NetTie

Net tie, 3 pin, 0.5mm square SMD pads

Pads
3
SMD
smd
Boards
6

DFN-10-1EP_2.6x2.6mm_P0.5mm_EP1.3x2.2mm

FP—

Package_DFN_QFN

DFN, 10 Pin (https://www.nxp.com/docs/en/data-sheet/PCF85063A.pdf#page=48)

Pads
11
SMD
3.9×3.1
Boards
6

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads
17
SMD
4.3×4.3
Boards
6

QFN-24-1EP_4x5mm_P0.5mm_EP2.65x3.65mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_24_05-08-1696.pdf)

Pads
25
SMD
5.3×6.3
Boards
6

QFN-28-1EP_4x5mm_P0.5mm_EP2.65x3.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/3555fe.pdf#page=32)

Pads
29
SMD
5.3×6.3
Boards
6

QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)

Pads
33
SMD
6.2×6.2
Boards
6

QFN-64-1EP_9x9mm_P0.5mm_EP6x6mm

FP3D

Package_DFN_QFN

QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42)

Pads
65
SMD
10.3×10.3
Boards
6

QFN-64-1EP_9x9mm_P0.5mm_EP7.3x7.3mm

FP—

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002304A.pdf (page 43))

Pads
65
SMD
10.3×10.3
Boards
6

ST_UFQFPN-20_3x3mm_P0.5mm

FP—

Package_DFN_QFN

UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)

Pads
20
SMD
3.5×3.5
Boards
6

Texas_RHH0036C_VQFN-36-1EP_6x6mm_P0.5mm_EP4.4x4.4mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RHH0036C VQFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=37)

Pads
37
SMD
7.3×7.3
Boards
6

TQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP3D

Package_DFN_QFN

TQFN, 16 Pin (https://www.diodes.com/assets/Datasheets/PI6C5946002.pdf#page=12)

Pads
17
SMD
4.3×4.3
Boards
6

Kionix_LGA-12_2x2mm_P0.5mm_LayoutBorder2x4y

FP—

Package_LGA

Kionix LGA, 12 Pin (https://www.digikey.com/Site/Global/Layouts/DownloadPdf.ashx?pdfUrl=3557DE8B1578472CBA17FB72BE0052DC#page=4)

Pads
12
SMD
2.5×2.5
Boards
6

LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_QFP

LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)

Pads
49
SMD
10.3×10.3
Boards
6

TSOP-I-28_11.8x8mm_P0.55mm

FP3D

Package_SO

TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)

Pads
28
SMD
14.9×8.7
Boards
6

WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)

Pads
9
SMD
4.3×3.5
Boards
6

Hirose_FH12-8S-0.5SH_1x08-1MP_P0.50mm_Horizontal

FP3D

Connector_FFC-FPC

Hirose FH12, FFC/FPC connector, FH12-8S-0.5SH, 8 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)

Pads
9
SMD
10.1×7.9
Boards
5

TE_3-1734839-4_1x34-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 34 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads
35
SMD
23.4×6.7
Boards
5

Fuseholder_Clip-5x20mm_Littelfuse_445-030_Inline_P20.50x5.20mm_D1.30mm_Horizontal

FP—

Fuse

Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 445/030, https://m.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_100_445_030_520_datasheet.pdf.pdf

Pads
2
THT
23.3×5.7
Boards
5

Fuseholder_Clip-5x20mm_Littelfuse_520_Inline_P20.50x5.80mm_D1.30mm_Horizontal

FP—

Fuse

Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 520, https://m.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_100_445_030_520_datasheet.pdf.pdf

Pads
2
THT
23.3×6.0
Boards
5

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
19.0×19.0
Boards
5