Footprints

302 footprints matching “SSO”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

302 footprints · page 9 of 13

Matched by name and keywords. Search by meaning instead

TSSOP-8_W4.4mm

FP—

digikey-Source_Footprints

http://www.st.com/content/ccc/resource/technical/document/datasheet/0d/30/c2/1a/92/03/48/cb/CD00287506.pdf/files/CD00287506.pdf/jcr:content/translations/en.CD00287506.pdf

Pads: 8
SMD: 7.1×3.5
Boards: —

Filter_KEMET_PZB300_24.0x12.5mm_P10.0mm

FP—

Filter

EMI suppression capacitor PZB300 series, length 24.0 mm, width 12.5 mm, drill hole 1.00mm ( https://content.kemet.com/datasheets/KEM_F3019_PZB300X2_2XY2_275.pdf )

Pads: 3
THT: 24.5×13.0
Boards: —

Sharp_SSOP-18_6x7.4mm_P0.8mm

FP—

gekkio-Gekkio_Package_SO

Sharp SSOP, 18 Pin (), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 18
SMD: 10.7×7.9
Boards: —

TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

gekkio-Gekkio_Package_SO

TSSOP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/05081663_K_FE20(CB).pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 21
SMD: 7.7×7.0
Boards: —

TSSOP-10_3x3mm_P0.5mm

FP—

jlcpcb-JLCPCB

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf)

Pads: 10
SMD: 5.9×3.6
Boards: —

TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL

FP—

jlcpcb-JLCPCB

TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL footprint

Pads: 16
SMD: 7.7×5.5
Boards: —

TSSOP-20_4.4x6.5mm_P0.65mm

FP—

jlcpcb-JLCPCB

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 20
SMD: 7.7×7.0
Boards: —

TSSOP-24_L7.8-W4.4-P0.65-LS6.4-BL

FP—

jlcpcb-JLCPCB

TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 24
SMD: 9.4×8.3
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP1.5x3.3mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias

FP—

Package_SO

Pads: 39
SMD: 7.7×10.2
Boards: —