Footprints

80 footprints matching “0.35”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

80 footprints · page 1 of 4

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BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lis2dh12.pdf)

Pads: 14
SMD: 2.2×2.2
Boards: 7

X2SON-8_1.4x1mm_P0.35mm

FP3D

Package_SON

X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf

Pads: 8
SMD: 1.7×1.9
Boards: 7

Hirose_BM24_BM24-40DP-2-0.35V_2x20_P0.35mm_PowerPin2_Vertical

FP—

Connector_Hirose

Hirose BM24 series connector, BM24-40DP/2-0.35V (https://www.hirose.com/product/en/download_file/key_name/BM24/category/Catalog/doc_file_id/47680/?file_category_id=4&item_id=50&is_series=1)

Pads: 42
SMD: 10.2×3.0
Boards: 4

QFN-48-1EP_5x5mm_P0.35mm_EP3.7x3.7mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.espressif.com/sites/default/files/documentation/esp32_datasheet_en.pdf#page=47)

Pads: 49
SMD: 6.2×6.2
Boards: 2

ArtInChip_QFN-68-1EP_7x7mm_P0.35mm_EP5.49x5.49mm

FP3D

Package_DFN_QFN

ArtInChip QFN, 68 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=42)

Pads: 69
SMD: 7.7×7.7
Boards: 1

QFN-48-1EP_5x5mm_P0.35mm_EP3.7x3.7mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.espressif.com/sites/default/files/documentation/esp32_datasheet_en.pdf#page=47)

Pads: 49
SMD: 6.2×6.2
Boards: 1

Fairchild_MicroPak2-6_1.0x1.0mm_P0.35mm

FP—

Package_SON

Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff

Pads: 6
SMD: 1.6×1.3
Boards: 1

SOT-963

FP3D

Package_TO_SOT_SMD

SOT 963 6 pins package 1x0.8mm pitch 0.35mm

Pads: 6
SMD: 1.6×1.5
Boards: 1

AVB0.35_2_X

FP—

agg-agg

Pads: 8
THT: 24.0×23.0
Boards: —

FUSE 0402_1005 0.35MM

FP—

celestial-altium-Fuse

Chip Fuse 2A AC 32V DC, 2 Leads, Body 1.00x0.52mm

Pads: 2
SMD: 1.9×0.9
Boards: —

Espressif VFQFN-48 5x5mm

FP—

celestial-altium-Leadless_QFN

QFN, 44-Leads, Body 5.00x5.00mm, Pitch 0.35mm, Thermal Pad 3.70x3.70mm, IPC Medium Density

Pads: 49
SMD: 6.0×6.0
Boards: —

TI X2SON-6 DSF

FP—

celestial-altium-Leadless_SON

SON, 6-Leads, Body 1.00x1.00mm, Pitch 0.35mm, IPC Medium Density

Pads: 6
SMD: 1.8×1.4
Boards: —

TOSHIBA WCSP-4 WCSP4F

FP—

celestial-altium-Leadless_WLCSP

WCSP, 4-Leads, Body 0.65x0.65mmx0.33mm, Pitch 0.35mm

Pads: 4
SMD: 1.0×1.0
Boards: —

Hirose_BM23FR0.6-16DP-0.35V_2x08_1MP_Vertical

FP—

Connector_Hirose

Hirose BM23 series connector, BM23FR0.6-16DP-0.35V (https://www.hirose.com/fr/product/document?clcode=CL0480-0290-0-95&productname=BM23FR0.6-16DP-0.35V(895)&series=BM23FR&documenttype=2DDrawing&lang=fr&documentid=D164551_en)

Pads: 17
SMD: 2.8×5.5
Boards: —

Hirose_BM23FR0.6-16DS-0.35V_2x08_P0.35_1MP_Vertical

FP—

Connector_Hirose

Hirose BM23 series connector, BM23FR0.6-16DS-0.35V (https://www.hirose.com/fr/product/document?clcode=CL0480-0295-0-51&productname=BM23FR0.6-16DS-0.35V(51)&series=BM23FR&documenttype=2DDrawing&lang=fr&documentid=D162179_en)

Pads: 17
SMD: 6.3×3.2
Boards: —

Hirose_BM24_BM24-40DS-2-0.35V_2x20_P0.35mm_PowerPin2_Vertical

FP—

Connector_Hirose

Hirose BM24 series connector, BM24-40DS/2-0.35V (https://www.hirose.com/product/en/download_file/key_name/BM24/category/Catalog/doc_file_id/47680/?file_category_id=4&item_id=50&is_series=1)

Pads: 42
SMD: 3.1×11.3
Boards: —