Footprints

631 footprints matching “0.4

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

631 footprints · page 1 of 27

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads
57
SMD
8.3×8.3
Boards
381

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm

FP

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads
21
SMD
4.3×4.3
Boards
83

InvenSense_QFN-24_3x3mm_P0.4mm

FP

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads
24
SMD
4.1×4.1
Boards
74

L_10.4x10.4_H4.8

FP

Inductor_SMD

Choke, SMD, 10.4x10.4mm 4.8mm height

Pads
2
SMD
11.5×10.9
Boards
63

C_0201_0603Metric_Pad0.64x0.40mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)

Pads
2
SMD
1.8×0.7
Boards
60

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads
21
SMD
4.2×4.2
Boards
47

R_0201_0603Metric_Pad0.64x0.40mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)

Pads
2
SMD
1.8×0.7
Boards
47

SOP-16_4.4x10.4mm_P1.27mm

FP3D

Package_SO

SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)

Pads
16
SMD
8.5×10.9
Boards
45

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads
57
SMD
8.3×8.3
Boards
34

SolderWire-0.1sqmm_1x01_D0.4mm_OD1mm

FP

Connector_Wire

Soldered wire connection, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
1
THT
2.6×2.6
Boards
28

SolderWire-0.1sqmm_1x02_P3.6mm_D0.4mm_OD1mm

FP

Connector_Wire

Soldered wire connection, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
6.2×2.6
Boards
28

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads
57
SMD
8.2×8.2
Boards
24

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
16.0×16.0
Boards
23

QFN-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm

FP

Package_DFN_QFN

QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20)

Pads
49
SMD
7.3×7.3
Boards
22

LGA-24L_3x3.5mm_P0.43mm

FP3D

Package_LGA

LGA 24L 3x3.5mm Pitch 0.43mm

Pads
24
SMD
4.2×3.7
Boards
22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads
57
SMD
8.3×8.3
Boards
21

SolderWire-0.1sqmm_1x04_P3.6mm_D0.4mm_OD1mm

FP

Connector_Wire

Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
4
THT
13.4×2.6
Boards
18

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads
41
SMD
6.2×6.2
Boards
18

QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm

FP

Package_DFN_QFN

QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)

Pads
49
SMD
7.2×7.2
Boards
17

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads
41
SMD
6.2×6.2
Boards
15

UQFN-10_1.4x1.8mm_P0.4mm

FP3D

Package_DFN_QFN

UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)

Pads
10
SMD
2.6×3.0
Boards
15

UQFN-20_3x3mm_P0.4mm

FP

Package_DFN_QFN

UQFN, 20 Pin (https://resurgentsemi.com/wp-content/uploads/2018/09/MPR121_rev5-Resurgent.pdf?d453f8&d453f8)

Pads
20
SMD
4.2×4.2
Boards
15

LED_0201_0603Metric_Pad0.64x0.40mm_HandSolder

FP3D

LED_SMD

LED SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf)

Pads
2
SMD
1.8×0.7
Boards
14

DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP3D

Package_DFN_QFN

DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)

Pads
15
SMD
4.0×3.6
Boards
14