Footprints

476 footprints matching “0.4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

476 footprints · page 1 of 20

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 381

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads: 21
SMD: 4.3×4.3
Boards: 83

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 47

SOP-16_4.4x10.4mm_P1.27mm

FP3D

Package_SO

SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)

Pads: 16
SMD: 8.5×10.9
Boards: 45

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

SolderWire-0.1sqmm_1x01_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 1
THT: 2.6×2.6
Boards: 28

SolderWire-0.1sqmm_1x02_P3.6mm_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 6.2×2.6
Boards: 28

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 24

QFN-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20)

Pads: 49
SMD: 7.3×7.3
Boards: 22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

SolderWire-0.1sqmm_1x04_P3.6mm_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 4
THT: 13.4×2.6
Boards: 18