Footprints
7 footprints matching “0.55”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
AD LFCSP-6 2X2MM CP-6-3
celestial-altium-Leadless_LFCSP
LFCSP, 6-Lead Lead Frame Chip Scale Package [LFCSP] 2.00 x 2.00 mm Body and 0.55 mm Package Height
- Pads
- 7
- SMD
- 3.2×2.4
- Boards
- —
TI VQFN-18 RNN0018A
celestial-altium-Leadless_QFN
VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm
- Pads
- 18
- SMD
- 4.3×4.3
- Boards
- —
TI VQFN-18 RNV0018B
celestial-altium-Leadless_QFN
VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm
- Pads
- 18
- SMD
- 4.3×4.3
- Boards
- —
RESNET 1506-16 CONVEX
celestial-altium-Resistor_Array
Array Chip Resistor, 16 leads, 8 resistors, Body 3.8x1.6mm Height 0.55mm
- Pads
- 16
- SMD
- 2.4×4.6
- Boards
- —
ISSI_TSOP-I-28_11.8x8mm_P0.55mm
gekkio-Gekkio_Package_SO
http://www.issi.com/WW/pdf/61LV256AL.pdf
- Pads
- 28
- SMD
- 9.0×14.7
- Boards
- —
VFBGA-86_6x6mm_Layout10x10_P0.55mm
Package_BGA
VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740
- Pads
- 86
- SMD
- 8.0×8.0
- Boards
- —
