Footprints
434 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×7.0
- Boards
- 731
TSSOP-16_4.4x5mm_P0.65mm
Package_SO
TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 16
- SMD
- 7.7×5.5
- Boards
- 579
TSSOP-14_4.4x5mm_P0.65mm
Package_SO
TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 14
- SMD
- 7.7×5.5
- Boards
- 507
MSOP-8_3x3mm_P0.65mm
Package_SO
MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 348
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
TSSOP-8_4.4x3mm_P0.65mm
Package_SO
TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 8
- SMD
- 7.7×3.5
- Boards
- 179
TSSOP-28_4.4x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 7.7×10.2
- Boards
- 164
Bosch_LGA-8_2.5x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 2.8×3.1
- Boards
- 118
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
Bosch_LGA-8_2x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8, https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMP280-DS001-18.pdf
- Pads
- 8
- SMD
- 3.1×2.6
- Boards
- 101
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 94
SSOP-20_5.3x7.2mm_P0.65mm
Package_SO
SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)
- Pads
- 20
- SMD
- 9.4×7.7
- Boards
- 77
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
SSOP-8_2.95x2.8mm_P0.65mm
Package_SO
SSOP-8 2.9 x2.8mm Pitch 0.65mm
- Pads
- 8
- SMD
- 5.5×3.3
- Boards
- 57
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 31
QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_DFN_QFN
QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 30
QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)
- Pads
- 29
- SMD
- 7.2×7.2
- Boards
- 30
VSSOP-8_3x3mm_P0.65mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 29