Footprints

422 footprints matching “0.8mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

422 footprints · page 1 of 18

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TQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)

Pads: 32
SMD: 10.3×10.3
Boards: 503

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

LQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf)

Pads: 32
SMD: 10.4×10.4
Boards: 185

TestPoint_2Pads_Pitch2.54mm_Drill0.8mm

FP—

TestPoint

Test point with 2 pins, pitch 2.54mm, drill diameter 0.8mm

Pads: 2
THT: 5.1×2.3
Boards: 146

TSOP-II-54_22.2x10.16mm_P0.8mm

FP3D

Package_SO

54-lead TSOP typ II package

Pads: 54
SMD: 13.5×22.7
Boards: 55

LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y

FP3D

Package_LGA

LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf)

Pads: 14
SMD: 3.5×5.5
Boards: 50

TSOP-II-44_10.16x18.41mm_P0.8mm

FP3D

Package_SO

TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads: 44
SMD: 13.2×18.9
Boards: 47

Texas_DRT-3

FP3D

Package_TO_SOT_SMD

Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf

Pads: 3
SMD: 1.6×1.4
Boards: 39

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads: 8
SMD: 3.5×3.5
Boards: 38

TestPoint_Bridge_Pitch2.54mm_Drill1.0mm

FP3D

TestPoint

wire loop as test point, pitch 2.54mm, hole diameter 1.0mm, wire diameter 0.8mm

Pads: 1
THT: 5.5×3.0
Boards: 35

Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad

FP—

Sensor_Humidity

Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://sensirion.com/media/documents/33FD6951/624C4357/Datasheet_SHT4x.pdf)

Pads: 4
SMD: 2.4×2.0
Boards: 34

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 16.0×16.0
Boards: 23

TQFP-64_14x14mm_P0.8mm

FP3D

Package_QFP

TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)

Pads: 64
SMD: 17.3×17.3
Boards: 18

Maxim_OLGA-14_3.3x5.6mm_P0.8mm

FP—

OptoDevice

https://pdfserv.maximintegrated.com/land_patterns/90-0602.PDF

Pads: 14
SMD: 3.8×6.1
Boards: 15

BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm

FP3D

Package_BGA

BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf

Pads: 96
SMD: 11.0×15.0
Boards: 15

L_Radial_D12.5mm_P7.00mm_Fastron_09HCP

FP3D

Inductor_THT

Inductor, Radial series, Radial, pin pitch=7.00mm, diameter=12.5mm, height=10.8mm, Fastron, 09HCP, http://cdn-reichelt.de/documents/datenblatt/B400/DS_09HCP.pdf

Pads: 2
THT: 13.0×13.0
Boards: 10

Nexperia_DSN1608-2_1.6x0.8mm

FP—

Diode_SMD

Diode SMD DSN1608, 1.6 x 0.8 x 0.29 mm, https://assets.nexperia.com/documents/package-information/SOD964.pdf

Pads: 2
SMD: 2.1×1.3
Boards: 9

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

TFBGA-100_8x8mm_Layout10x10_P0.8mm

FP3D

Package_BGA

TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199

Pads: 100
SMD: 10.0×10.0
Boards: 8

PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)

Pads: 44
SMD: 14.5×14.5
Boards: 7

Micron_FBGA-96_9x14mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26

Pads: 96
SMD: 11.0×16.0
Boards: 4