Footprints

64 footprints matching “10x10mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

64 footprints · page 1 of 3

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LQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)

Pads: 64
SMD: 13.4×13.4
Boards: 663

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 64
SMD: 13.3×13.3
Boards: 58

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)

Pads: 44
SMD: 14.5×14.5
Boards: 7

LQFP-64-1EP_10x10mm_P0.5mm_EP5x5mm

FP—

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf)

Pads: 65
SMD: 13.4×13.4
Boards: 5

LQFP-64-1EP_10x10mm_P0.5mm_EP5x5mm_ThermalVias

FP—

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf)

Pads: 65
SMD: 13.4×13.4
Boards: 4

UFBGA-201_10x10mm_Layout15x15_P0.65mm

FP—

Package_BGA

UFBGA-201, 10.0x10.0mm, 201 Ball, 15x15 Layout, 0.65mm Pitch, http://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=166

Pads: 201
SMD: 12.0×12.0
Boards: 3

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads: 81
SMD: 11.2×11.2
Boards: 3

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads: 65
SMD: 13.3×13.3
Boards: 3

LQFP-80_10x10mm_P0.4mm

FP3D

Package_QFP

LQFP, 80 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q80.10x10.pdf)

Pads: 80
SMD: 13.3×13.3
Boards: 3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

QFN-72-1EP_10x10mm_P0.5mm_EP6x6mm

FP—

Package_DFN_QFN

QFN, 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70)

Pads: 73
SMD: 11.3×11.3
Boards: 2

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads: 81
SMD: 11.2×11.2
Boards: 2

LFBGA-100_10x10mm_Layout10x10_P0.8mm

FP3D

Package_BGA

LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87

Pads: 100
SMD: 12.0×12.0
Boards: 1

LFBGA-144_10x10mm_Layout12x12_P0.8mm

FP3D

Package_BGA

LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114

Pads: 144
SMD: 12.0×12.0
Boards: 1

TFBGA-121_10x10mm_Layout11x11_P0.8mm

FP3D

Package_BGA

TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495

Pads: 121
SMD: 12.0×12.0
Boards: 1

UFBGA-144_10x10mm_Layout12x12_P0.8mm

FP—

Package_BGA

UFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f446ze.pdf#page=189

Pads: 144
SMD: 12.0×12.0
Boards: 1

Xilinx_CPG236

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 10x10mm, 238 Ball, 19x19 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266

Pads: 238
SMD: 12.0×12.0
Boards: 1

Xilinx_CPG238

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 10x10mm, 238 Ball, 19x19 Layout, 0.5mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267

Pads: 238
SMD: 12.0×12.0
Boards: 1

LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm

FP—

Package_CSP

LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)

Pads: 73
SMD: 11.3×11.3
Boards: 1

LQFP-52_10x10mm_P0.65mm

FP3D

Package_QFP

LQFP, 52 Pin (https://www.nxp.com/docs/en/package-information/98ARL10526D.pdf)

Pads: 52
SMD: 13.3×13.3
Boards: 1

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm_ThermalVias

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads: 65
SMD: 13.3×13.3
Boards: 1

TerminalBlock_RND_205-00276_1x02_P5.00mm_Vertical

FP—

TerminalBlock_RND

terminal block RND 205-00078, vertical (cable from top), 2 pins, pitch 5mm, size 10x10mm, drill diameter 1.3mm, pad diameter 2.5mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00276_DB_EN.pdf

Pads: 2
THT: 11.0×11.0
Boards: 1