Footprints

254 footprints matching “14mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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254 footprints · page 1 of 11

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LQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)

Pads: 100
SMD: 17.5×17.5
Boards: 273

CP_Radial_D8.0mm_P3.80mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=3.80mm, diameter=8mm, height=14mm, Electrolytic Capacitor

Pads: 2
THT: 8.5×8.5
Boards: 130

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

TQFP-64_14x14mm_P0.8mm

FP3D

Package_QFP

TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)

Pads: 64
SMD: 17.3×17.3
Boards: 18

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads: 57
SMD: 9.6×14.6
Boards: 16

CP_Radial_D14.0mm_P5.00mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=5.00mm, diameter=14mm, height=20mm, Electrolytic Capacitor

Pads: 2
THT: 14.5×14.5
Boards: 11

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9

Indicator_PUI_AI-1440-TWT-24V-2-R

FP3D

Buzzer_Beeper

14mm Indicator, https://www.puiaudio.com/media/SpecSheet/AI-1440-TWT-24V-2-R.pdf

Pads: 2
THT: 14.3×14.3
Boards: 8

Buzzer_D14mm_H7mm_P10mm

FP—

Buzzer_Beeper

Generic Buzzer, D14mm height 7mm with pitch 10mm

Pads: 2
THT: 14.5×14.5
Boards: 7

TerminalBlock_WAGO_236-402_1x02_P5.00mm_45Degree

FP—

TerminalBlock_WAGO

Terminal Block WAGO 236-402, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 12.3x14mm, drill diameter 1.15mm, pad diameter 3mm,

Pads: 2
THT: 13.3×15.0
Boards: 7

Transformer_Toroid_Horizontal_D14.0mm_Amidon-T50

FP—

Transformer_THT

Transformer, Toroid, horizontal, laying, Diameter 14mm, Amidon T50,

Pads: 4
THT: 19.5×15.5
Boards: 6

Heatsink_Stonecold_HS-132_32x14mm_2xFixation1.5mm

FP3D

Heatsink

Heatsink, StoneCold HS

Pads: 1
THT: 32.0×14.0
Boards: 5

CP_Radial_D14.0mm_P7.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=7.50mm, diameter=14mm, height=20mm, Electrolytic Capacitor

Pads: 2
THT: 14.5×14.5
Boards: 4

TE_MATE-N-LOK_1-770870-x_1x03_P4.14mm_Vertical

FP—

Connector_TE-Connectivity

Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770870-x, 3 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN)

Pads: 3
THT: 7.3×19.5
Boards: 4

Micron_FBGA-96_9x14mm_Layout9x16_P0.8mm

FP—

Package_BGA

FBGA-96, 9.0x14.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26

Pads: 96
SMD: 11.0×16.0
Boards: 4

TQFP-100-1EP_14x14mm_P0.5mm_EP5x5mm

FP3D

Package_QFP

TQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf)

Pads: 101
SMD: 17.3×17.3
Boards: 4

TQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 128
SMD: 17.3×17.3
Boards: 4

TerminalBlock_WAGO_236-102_1x02_P5.00mm_45Degree

FP—

TerminalBlock_WAGO

Terminal Block WAGO 236-102, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 12.3x14mm, drill diameter 1.15mm, pad diameter 3mm,

Pads: 2
THT: 13.3×15.0
Boards: 4

LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm

FP—

Package_CSP

LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)

Pads: 29
SMD: 6.2×6.2
Boards: 3

TSOP-I-56_18.4x14mm_P0.5mm

FP3D

Package_SO

TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)

Pads: 56
SMD: 21.5×14.5
Boards: 3

TE_MATE-N-LOK_1-770966-x_1x02_P4.14mm_Horizontal

FP—

Connector_TE-Connectivity

Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770966-x, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN)

Pads: 2
THT: 10.9×16.9
Boards: 2

TE_MATE-N-LOK_1-770968-x_2x02_P4.14mm_Horizontal

FP—

Connector_TE-Connectivity

Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770968-x, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN)

Pads: 4
THT: 20.7×10.9
Boards: 2