Footprints

14 footprints matching “156”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

14 footprints

Matched by name and keywords. Search by meaning instead

4UCON_10156_2x40_P1.27mm_Socket_Horizontal

FP—

Connector_PCBEdge

4UCON 10156 Card edge socket with 80 contacts (40 each side), through-hole, http://www.4uconnector.com/online/object/4udrawing/10156.pdf

Pads
80
THT
57.9×22.4
Boards
2

Crystal_SMD_SeikoEpson_MC156-4Pin_7.1x2.5mm_HandSoldering

FP—

Crystal

Seiko Epson MC-156, Crystal, 7.1x2.5mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf

Pads
4
SMD
8.1×6.0
Boards
2

CoaxialSwitch_Hirose_MS-156C3_Horizontal

FP—

Connector_Coaxial

Subminiature Coaxial Switch 1.35mm High, DC to 11GHz

Pads
3
SMD
3.4×3.5
Boards
1

Mounting_Wuerth_WA-SMSI-M1.6_H1.5mm_9774015633

FP3D

Mounting_Wuerth

Mounting Hardware, inside through hole M1.6, height 1.5, Wuerth electronics 9774015633 (https://www.we-online.com/components/products/datasheet/9774015633R.pdf)

Pads
1
SMD
4.5×4.5
Boards
1

HIROSE MS-156HF

FP—

celestial-altium-Connector_Hirose

Coaxial Switch - 4mm Plug Dia Connector Receptacle, Female Socket 50 Ohms Surface Mount Solder

Pads
3
SMD
3.6×4.0
Boards
—

Crystal_SMD_SeikoEpson_MC156-4Pin_7.1x2.5mm

FP—

Crystal

Seiko Epson MC-156, Crystal, 7.1x2.5mm package, SMD, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf

Pads
4
SMD
8.1×4.5
Boards
—

Sharp_QFP-156_14x20mm_P0.4mm

FP—

gekkio-Gekkio_Package_QFP

Sharp QFP, 156 Pin (), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads
156
SMD
18.1×24.1
Boards
—

BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm

FP3D

Package_BGA

BGA-1156

Pads
1156
SMD
37.0×37.0
Boards
—

Xilinx_FFG1156

FP—

Package_BGA

Artix-7, Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91

Pads
1156
SMD
37.0×37.0
Boards
—

Xilinx_FFG1157_FFG1158

FP—

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299

Pads
1156
SMD
37.0×37.0
Boards
—

Xilinx_RF1156

FP—

Package_BGA

Zynq-7000 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95

Pads
1156
SMD
37.0×37.0
Boards
—

Xilinx_RF1157_RF1158

FP—

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 35x35mm, 1156 Ball, 34x34 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305

Pads
1156
SMD
37.0×37.0
Boards
—

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads
156
SMD
7.0×6.6
Boards
—

TerminalBlock_Degson_DG250-3.5-44P_1x44_P3.50mm_45Degree

FP—

TerminalBlock_Degson

Terminal Block Degson DG250-3.5-44P, 45Degree (cable under 45degree), 44 pins, pitch 3.5mm, size 156x12mm, drill diameter 1.2mm, pad diameter 3mm, https://www.degson.com/content/details_552_879717.html?lang=en

Pads
44
THT
156.5×13.0
Boards
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