Footprints

11 footprints matching “168”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

11 footprints

Matched by name and keywords. Search by meaning instead

SD-SIM_microSD-microSIM_Molex_104168-1620

FP—

Connector_Card

microSD and microSIM connector, https://www.molex.com/pdm_docs/sd/1041681620_sd.pdf

Pads: 18
SMD: 15.9×19.3
Boards: —

Hirose_FX10A-168P-SV_2x84-1MP_P0.5mm

FP—

Connector_Hirose

0.5 mm pitch, stacking height 4 mm to 13 mm, 168 contacts, header, vertical, with guideposts (source: https://www.hirose.com/de/product/document?clcode=&productname=&series=FX10&documenttype=Catalog&lang=de&documentid=D31650_en)

Pads: 169
SMD: 50.5×7.3
Boards: —

Hirose_FX10A-168S-SV_2x84-1MP_P0.5mm

FP—

Connector_Hirose

0.5 mm pitch, stacking height 4 mm to 13 mm, 168 contacts, receptacle, vertical, with guideposts (source: https://www.hirose.com/de/product/document?clcode=&productname=&series=FX10&documenttype=Catalog&lang=de&documentid=D31650_en)

Pads: 169
SMD: 50.5×8.7
Boards: —

Hirose_FX10B-168P-SV_2x84-1MP_P0.5mm

FP—

Connector_Hirose

0.5 mm pitch, stacking height 4 mm to 13 mm, 168 contacts, header, vertical (source: https://www.hirose.com/de/product/document?clcode=&productname=&series=FX10&documenttype=Catalog&lang=de&documentid=D31650_en)

Pads: 169
SMD: 50.5×7.3
Boards: —

Hirose_FX10B-168S-SV_2x84-1MP_P0.5mm

FP—

Connector_Hirose

0.5 mm pitch, stacking height 4 mm to 13 mm, 168 contacts, receptacle, vertical (source: https://www.hirose.com/de/product/document?clcode=&productname=&series=FX10&documenttype=Catalog&lang=de&documentid=D31650_en)

Pads: 169
SMD: 50.5×8.7
Boards: —

Wago_734-168_1x08_P3.50mm_Horizontal

FP—

Connector_Wago

Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-168 , 8 Pins (http://www.farnell.com/datasheets/2157639.pdf)

Pads: 8
THT: 31.4×11.3
Boards: —

Maxim_WLCSP-35_2.998x2.168mm_Layout7x5_P0.4mm

FP—

Package_CSP

WLCSP-35, 2.998x2.168mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF

Pads: 35
SMD: 5.0×4.2
Boards: —

ST_WLCSP-168_Die434

FP—

Package_CSP

WLCSP-168, 4.891x5.692mm, 168 Ball, 12x14 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f469ni.pdf#page=198

Pads: 168
SMD: 6.9×7.7
Boards: —

PQFP-168_28x28mm_P0.65mm

FP—

Package_QFP

PQFP, 168 Pin (https://www.renesas.cn/cn/zh/document/psc/package-drawing-qfp-168pin-prqp0168jb)

Pads: 168
SMD: 32.6×32.6
Boards: —

Mini-Circuits_MMM168

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf)

Pads: 4
SMD: 4.0×3.4
Boards: —

Mini-Circuits_MMM168_LandPatternPL-225

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case MMM168, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf)

Pads: 4
SMD: 7.2×4.5
Boards: —