Footprints

5 footprints matching “16C”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5 footprints

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USB_C_Receptacle_GCT_USB4105-xx-A_16P_TopMnt_Horizontal

FP3D

Connector_USB

USB 2.0 Type C Receptacle, GCT, 16P, top mounted, horizontal, 5A: https://gct.co/files/drawings/usb4105.pdf

Pads: 17
SMD: 10.6×8.9
Boards: 452

USB_C_Receptacle_GCT_USB4110

FP—

Connector_USB

USB 2.0 Type C Receptacle, GCT, 16P, top mounted, horizontal, 5A, https://gct.co/files/drawings/usb4110.pdf

Pads: 17
SMD: 13.4×8.9
Boards: 45

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 31

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm

FP—

Package_SO

Pads: 17
SMD: 7.8×5.5
Boards: 9

TI WQFN-16 RTE0016C

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.68x1.68mm, IPC Medium Density

Pads: 17
SMD: 4.2×4.2
Boards: —