Footprints
13 footprints matching “44mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Fuse_Bourns_MF-SM_7.98x5.44mm
Fuse
https://www.bourns.com/docs/Product-Datasheets/mfsm.pdf
- Pads
- 2
- SMD
- 10.2×5.9
- Boards
- 5
Transformer_37x44
Transformer_THT
transformer 37x44mm²
- Pads
- 4
- THT
- 43.7×38.6
- Boards
- 2
CP_Axial_L38.0mm_D21.0mm_P44.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=44mm, length*diameter=38*21mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/28325/021asm.pdf
- Pads
- 2
- THT
- 46.9×21.5
- Boards
- 1
L_Toroid_Vertical_L24.6mm_W15.5mm_P11.44mm_Pulse_KM-4
Inductor_THT
L_Toroid, Vertical series, Radial, pin pitch=11.44mm, length*width=24.64*15.5mm^2, Pulse, KM-4, http://datasheet.octopart.com/PE-92112KNL-Pulse-datasheet-17853305.pdf
- Pads
- 2
- THT
- 25.1×16.0
- Boards
- 1
CP_Axial_L38.0mm_D18.0mm_P44.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=44mm, length*diameter=38*18mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/28325/021asm.pdf
- Pads
- 2
- THT
- 46.9×18.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm
Package_CSP
WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf
- Pads
- 56
- SMD
- 5.2×5.5
- Boards
- —
DFN-24-1EP_4x7mm_P0.5mm_EP2.64x6.44mm
Package_DFN_QFN
DKD Package; 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf)
- Pads
- 25
- SMD
- 5.0×7.6
- Boards
- —
DFN-32-1EP_4x7mm_P0.4mm_EP2.64x6.44mm
Package_DFN_QFN
DKD Package; 32-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf)
- Pads
- 33
- SMD
- 5.0×7.6
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm
Package_QFP
Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm_ThermalVias
Package_QFP
Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —