Footprints

147 footprints matching “45mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

147 footprints · page 1 of 7

Matched by name and keywords. Search by meaning instead

C_0805_2012Metric_Pad1.18x1.45mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)

Pads: 2
SMD: 3.8×2.0
Boards: 2,589

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 176

TO-247-3_Vertical

FP3D

Package_TO_SOT_THT

TO-247-3, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html

Pads: 3
THT: 16.4×5.5
Boards: 49

WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm

FP—

Package_DFN_QFN

WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)

Pads: 15
SMD: 3.7×3.7
Boards: 39

Fuse_2920_7451Metric_Pad2.10x5.45mm_HandSolder

FP—

Fuse

Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://www.megastar.com/products/fusetronic/polyswitch/PDF/smd2920.pdf)

Pads: 2
SMD: 9.6×6.0
Boards: 36

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 16.0×16.0
Boards: 23

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 18

TerminalBlock_RND_205-00232_1x02_P5.08mm_Horizontal

FP—

TerminalBlock_RND

terminal block RND 205-00232, 2 pins, pitch 5.08mm, size 10.2x8.45mm, drill diameter 1.1mm, pad diameter 2.1mm, http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf

Pads: 2
THT: 11.2×9.4
Boards: 18

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 16

CP_Radial_D25.0mm_P10.00mm_SnapIn

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=10.00mm, diameter=25mm, height=45mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf

Pads: 2
THT: 25.5×25.5
Boards: 15

QFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm

FP—

Package_DFN_QFN

QFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 12

R_2816_7142Metric_Pad3.20x4.45mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 2816 (7142 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: https://www.vishay.com/docs/30100/wsl.pdf)

Pads: 2
SMD: 8.9×5.0
Boards: 12