Footprints

5 footprints matching “46mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5 footprints

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DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 15

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: 3

CP_Axial_L46.0mm_D20.0mm_P52.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=52mm, length*diameter=46*20mm^2, Electrolytic Capacitor

Pads: 2
THT: 55.3×20.5
Boards: —

L_Toroid_Vertical_L46.0mm_W19.1mm_P21.80mm_Bourns_5700

FP—

Inductor_THT

L_Toroid, Vertical series, Radial, pin pitch=21.80mm, length*width=46*19.1mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf

Pads: 2
THT: 46.5×26.1
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —