Footprints
4 footprints matching “80-ball”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TFBGA-80_9x16mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 80 balls (JEDEC MO-210Q), 16.0x9.0mm, 80 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 80
- SMD
- 11.0×18.0
- Boards
- —
Texas_MicroStar_Junior_BGA-80_5.0x5.0mm_Layout9x9_P0.5mm
Package_BGA
Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)
- Pads
- 80
- SMD
- 6.0×6.0
- Boards
- —
Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm
Package_CSP
WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 80
- SMD
- 6.5×5.6
- Boards
- —
ST_WLCSP-80_3.5x3.27mm_Layout10x16_P0.35mm_Stagger_Offcenter
Package_CSP
ST WLCSP-80, ST die ID 484, 3.5x3.27mm, 80 Ball, Y-staggered 10x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h563mi.pdf
- Pads
- 80
- SMD
- 5.5×5.3
- Boards
- —
