Footprints

114 footprints matching “86”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

114 footprints · page 1 of 5

Matched by name and keywords. Search by meaning instead

USB_Mini-B_Lumberg_2486_01_Horizontal

FP3D

Connector_USB

USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf

Pads
6
SMD
11.9×10.6
Boards
96

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads
100
SMD
17.3×17.3
Boards
93

BatteryHolder_Keystone_1042_1x18650

FP3D

Battery

Battery holder, Keystone 1042, battery type 1x18650, http://www.keyelco.com/product.cfm/product_id/918

Pads
2
SMD
87.9×21.7
Boards
73

Potentiometer_Bourns_3386P_Vertical

FP—

Potentiometer_THT

Potentiometer, vertical, Bourns 3386P, https://www.bourns.com/pdfs/3386.pdf

Pads
3
THT
10.0×10.0
Boards
68

Potentiometer_Bourns_3386F_Vertical

FP—

Potentiometer_THT

Potentiometer, vertical, Bourns 3386F, https://www.bourns.com/pdfs/3386.pdf

Pads
3
THT
10.0×10.0
Boards
21

Potentiometer_Bourns_3386C_Horizontal

FP—

Potentiometer_THT

Potentiometer, horizontal, Bourns 3386C, https://www.bourns.com/pdfs/3386.pdf

Pads
3
THT
5.3×10.0
Boards
19

HDMI_A_Molex_208658-1001_Horizontal

FP3D

Connector_Video

HDMI Molex Type A https://www.molex.com/pdm_docs/sd/2086581001_sd.pdf

Pads
20
SMD
13.6×17.0
Boards
16

WLP-4_0.86x0.86mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.86x0.86mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-0612.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads
4
SMD
2.9×2.9
Boards
12

DIP-64_W22.86mm_Socket

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket

Pads
64
THT
25.9×81.9
Boards
8

DIP-64_W22.86mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads

Pads
64
THT
25.9×81.9
Boards
8

SOT-886

FP3D

Package_TO_SOT_SMD

SOT-886

Pads
6
SMD
1.5×2.0
Boards
8

Potentiometer_Bourns_3386X_Horizontal

FP—

Potentiometer_THT

Potentiometer, horizontal, Bourns 3386X, https://www.bourns.com/pdfs/3386.pdf

Pads
3
THT
5.3×10.0
Boards
8

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads
64
THT
25.0×81.8
Boards
5

PQFP-132_24x24mm_P0.635mm_i386

FP3D

Package_QFP

PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)

Pads
132
SMD
28.9×28.9
Boards
5

TerminalBlock_MetzConnect_Type086_RT03402HBLC_1x02_P3.81mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type086_RT03402HBLC, 2 pins, pitch 3.81mm, size 7.51x7.3mm, drill diameter 1.1mm, pad diameter 1.75mm, https://www.metz-connect.com/externalfiles/310861/863404.PDF

Pads
2
THT
8.5×8.3
Boards
5

Potentiometer_Bourns_3386W_Horizontal

FP3D

Potentiometer_THT

Potentiometer, horizontal, Bourns 3386W, 9.53 x 4.83 x 9.53mm, https://www.bourns.com/docs/Product-Datasheets/3386.pdf

Pads
3
THT
10.0×5.3
Boards
4

R_Axial_DIN0918_L18.0mm_D9.0mm_P22.86mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0918 series, Axial, Horizontal, pin pitch=22.86mm, 4W, length*diameter=18*9mm^2

Pads
2
THT
25.8×9.5
Boards
4

TerminalBlock_MetzConnect_Type086_RT03404HBLC_1x04_P3.81mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type086_RT03404HBLC, 4 pins, pitch 3.81mm, size 15.1x7.3mm, drill diameter 1.1mm, pad diameter 1.75mm, https://www.metz-connect.com/externalfiles/310861/863404.PDF

Pads
4
THT
16.1×8.3
Boards
4

Molex_CLIK-Mate_502386-0470_1x04-1MP_P1.25mm_Horizontal

FP—

Connector_Molex

Molex CLIK-Mate series connector, 502386-0470 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf)

Pads
5
SMD
9.5×6.4
Boards
3

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
13
SMD
4.3×3.6
Boards
3

SIPAK_Vertical

FP—

Package_TO_SOT_THT

SIPAK, Vertical, RM 2.286mm

Pads
3
THT
7.1×2.8
Boards
3

BatteryClip_Keystone_54_D16-19mm

FP3D

Battery

Battery clip for batteries with a diameter between 16-19 mm: https://www.keyelco.com/product.cfm/product_id/826

Pads
1
THT
14.1×20.0
Boards
2

L_CommonMode_Toroid_Vertical_L38.1mm_W20.3mm_Px15.24mm_Py22.86mm_Bourns_8100

FP3D

Inductor_THT

L_CommonMode_Toroid, Vertical series, Radial, pin pitch=15.24*22.86mm^2, length*width=38.099999999999994*20.32mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf

Pads
4
THT
38.6×20.8
Boards
2

DIP-64_W22.86mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads

Pads
64
THT
25.8×81.8
Boards
2