Footprints
33 footprints matching “Devices”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Electrosmith_Daisy_Seed
Module
Embedded platform for audio applications. 96kHz / 24-bit audio hardware. 64MB of SDRAM for up to 10 minute long audio. ARM Cortex-M7 MCU, running at 480MHz. 31 total GPIO pins with configurable functionality. 12-bit Digital to Analog Converters (x2). SD card interfaces. PWM outputs. Serial Protocols for connecting external sensors and devices (SPI, UART, I2S, I2C). Dedicated VIN pin for power. Micro USB port, and additional USB pins for full OTG-support as host and device. https://static1.squarespace.com/static/58d03fdc1b10e3bf442567b8/t/6227e6236f02fb68d1577146/1646781988478/Daisy_Seed_datasheet_v1.0.3.pdf
- Pads
- 40
- THT
- 18.7×53.0
- Boards
- 17
BatteryHolder_MPD_BA9VPC_1xPP3
Battery
1xPP3 (9V) battery holder, Memory Protection Devices P/N BA9VPC, http://www.memoryprotectiondevices.com/datasheets/BA9VPC-datasheet.pdf
- Pads
- 2
- THT
- 55.9×32.4
- Boards
- 6
BatteryHolder_MPD_BC2AAPC_2xAA
Battery
2xAA cell battery holder, Memory Protection Devices P/N BC2AAPC, http://www.memoryprotectiondevices.com/datasheets/BC2AAPC-datasheet.pdf
- Pads
- 2
- THT
- 59.0×31.5
- Boards
- 4
Analog_LCC-8_5x5mm_P1.27mm
Package_LCC
LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf
- Pads
- 8
- SMD
- 6.3×6.4
- Boards
- 4
WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm
Package_DFN_QFN
WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)
- Pads
- 29
- SMD
- 5.3×5.3
- Boards
- 2
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 2
BatteryHolder_MPD_BC12AAPC_2xAA
Battery
2xAA cell battery holder, Memory Protection Devices P/N BC12AAPC, http://www.memoryprotectiondevices.com/datasheets/BC12AAPC-datasheet.pdf
- Pads
- 2
- THT
- 108.8×17.2
- Boards
- —
ANALOG DEVICES TQFP_EP-100 SV-100-1
celestial-altium-Leaded_LQFP
TQFP_EP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, Thermal Pad 6.50x6.50mm, IPC Medium Density
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
ANALOG DEVICES SC70-6 KS-6
celestial-altium-Leaded_SC_70
SOT23, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm
- Pads
- 6
- SMD
- 3.6×2.6
- Boards
- —
ANALOG DEVICES SOT-23-6 RJ-6
celestial-altium-Leaded_SOT_23
SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm
- Pads
- 6
- SMD
- 4.2×3.4
- Boards
- —
ANALOG DEVICES HMC637ALP5E
celestial-altium-Leadless_QFN
QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.70x3.70mm, IPC Medium Density
- Pads
- 13
- SMD
- 6.2×6.2
- Boards
- —
ANALOG DEVICES LFCSP-20 CP-20-8
celestial-altium-Leadless_QFN
LFCSP, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.55x2.55mm
- Pads
- 21
- SMD
- 5.0×5.0
- Boards
- —
ANALOG DEVICES QFN-52 UKG 05-08-1729
celestial-altium-Leadless_QFN
QFN, 52-Leads, Body 7.00x8.00mm, Pitch 0.50mm, Thermal Pad 5.41x6.45mm
- Pads
- 53
- SMD
- 7.8×8.8
- Boards
- —
CUI Devices CMA-4544PF-W
celestial-altium-Microphone
Analog Microphone 9.7mm Dia
- Pads
- 2
- THT
- 10.2×10.2
- Boards
- —
SD_Card_Device_16mm_SlotDepth
Connector_Card
SD card device PCB layout, contacts and mechanicalm, 16mm slot depth. Manufacture with PCB thickness of 1.4mm, http://www.convict.lu/pdf/ProdManualSDCardv1.9.pdf
- Pads
- 9
- Mount
- 24.9×16.9
- Boards
- —
ESP32-S31-WROOM-3
espressif-Espressif
Built-in ESP32-S31 series chip, featuring a RISC-V 32-bit dual-core microprocessor, suitable for embedded systems, smart home, wearable electronic devices, and other IoT scenarios
- Pads
- 99
- SMD
- 22.5×30.5
- Boards
- —
Carambola2
Module
8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf
- Pads
- 52
- SMD
- 30.9×40.9
- Boards
- —
Analog_BGA-77_9x15mm_Layout7x11_P1.27mm
Package_BGA
Analog Devices BGA-77, 0.63mm pad, 9x15mm, 77 Ball, 7x11 Layout, 1.27mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081964_B_bga77.pdf
- Pads
- 77
- SMD
- 11.0×17.0
- Boards
- —
Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm
Package_BGA
Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf
- Pads
- 134
- SMD
- 17.0×17.0
- Boards
- —
Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm
Package_CSP
LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)
- Pads
- 5
- SMD
- 4.0×3.5
- Boards
- —
VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- —
VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- —
WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)
- Pads
- 29
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —