Footprints

129 footprints matching “Long”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

129 footprints · page 1 of 6

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DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

DIP-14_W7.62mm_Socket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

DIP-14_W7.62mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

DIP-16_W7.62mm_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 16
THT: 10.5×20.8
Boards: 199

DIP-16_W7.62mm_Socket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 16
THT: 10.7×20.9
Boards: 189

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

HOPERF_RFM9XW_SMD

FP—

RF_Module

Low Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf)

Pads: 16
SMD: 18.5×16.5
Boards: 105

DIP-20_W7.62mm_Socket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 20
THT: 10.7×26.0
Boards: 100

DIP-40_W15.24mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 40
THT: 18.3×51.4
Boards: 99

DIP-20_W7.62mm_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 20
THT: 10.5×25.9
Boards: 84

DIP-28_W15.24mm_Socket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 28
THT: 18.3×36.2
Boards: 59

DIP-28_W7.62mm_Socket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 28
THT: 10.7×36.2
Boards: 48

DIP-40_W15.24mm_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 40
THT: 18.1×51.3
Boards: 45

DIP-28_W15.24mm_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 28
THT: 18.1×36.1
Boards: 37

DIP-18_W7.62mm_Socket_LongPads

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 18
THT: 10.7×23.5
Boards: 32

DIP-28_W7.62mm_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 28
THT: 10.5×36.1
Boards: 31

DIP-24_W7.62mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 24
THT: 10.7×31.1
Boards: 28

DIP-6_W7.62mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 6
THT: 10.5×8.1
Boards: 27

DIP-32_W15.24mm_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 32
THT: 18.1×41.2
Boards: 24

DIP-24_W15.24mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 24
THT: 18.3×31.1
Boards: 22

DIP-6_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 6
SMD: 12.5×8.2
Boards: 21

DIP-4_W7.62mm_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 4
THT: 10.5×5.6
Boards: 19

DIP-32_W15.24mm_Socket_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 32
THT: 18.3×41.3
Boards: 18

Electrosmith_Daisy_Seed

FP—

Module

Embedded platform for audio applications. 96kHz / 24-bit audio hardware. 64MB of SDRAM for up to 10 minute long audio. ARM Cortex-M7 MCU, running at 480MHz. 31 total GPIO pins with configurable functionality. 12-bit Digital to Analog Converters (x2). SD card interfaces. PWM outputs. Serial Protocols for connecting external sensors and devices (SPI, UART, I2S, I2C). Dedicated VIN pin for power. Micro USB port, and additional USB pins for full OTG-support as host and device. https://static1.squarespace.com/static/58d03fdc1b10e3bf442567b8/t/6227e6236f02fb68d1577146/1646781988478/Daisy_Seed_datasheet_v1.0.3.pdf

Pads: 40
THT: 18.7×53.0
Boards: 17