Footprints

16 footprints matching “Semiconductor”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

16 footprints

Matched by name and keywords. Search by meaning instead

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads: 9
SMD: 2.8×2.5
Boards: 20

DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm

FP3D

Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: 10

OnSemi_Micro8

FP3D

Package_SO

ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF

Pads: 8
SMD: 5.8×3.6
Boards: 1

ON Semiconductor SC-75

FP—

celestial-altium-Leaded_SOT

SOT, 3-Leads, Body 1.60x0.80mm, Pitch 1mm, IPC Medium Density

Pads: 3
SMD: 2.3×2.0
Boards: —

ON SEMICONDUCTOR H11L1SR2M

FP—

celestial-altium-Optoisolator

Logic Output Optoisolator 1MHz Open Collector 5000Vrms 1 Channel CMTI, 2.54mm Pitch, 6.35x8.51mm Body, 6-SMD Package

Pads: 6
SMD: 11.2×9.0
Boards: —

Heatsink_AAVID_573100_TO-252

FP—

gekkio-Gekkio_Heatsink

Surface mount heat sink for D-PAK (TO-252) package semiconductors

Pads: 1
SMD: 23.7×9.7
Boards: —

DFN-6-1EP_3x3mm_P0.95mm_EP1.35x2.15mm

FP—

gekkio-Gekkio_Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AX (see ON Semiconductor 506AX.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: —

TQFP-128_14x14mm_P0.4mm_PAD

FP3D

muratovas-MAS_Package_std

TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)

Pads: 129
SMD: 16.9×16.9
Boards: —

Dialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mm

FP—

Package_CSP

Dialog Semiconductor (Renesas) WLCSP-34, staggered array, 4.54x1.66mm, 34 Ball, 17x4 Layout, 0.25x0.34mm Pitch, https://www.renesas.com/us/en/document/dst/da7212-datasheet

Pads: 34
SMD: 6.5×3.7
Boards: —