Footprints
7 footprints matching “Winbond”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
Winbond_USON-8-2EP_3x4mm_P0.8mm_EP0.2x0.8mm
Package_SON
Winbond USON, 8 Pin (https://www.winbond.com/hq/support/documentation/levelOne.jsp?__locale=en&DocNo=DA00-W25Q16JV.1#page=69), generated with kicad-footprint-generator ipc_noLead_generator.py
- Pads
- 9
- SMD
- 4.3×4.5
- Boards
- 1
WINBOND SOIC-8
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
WINBOND SOIC-8 208MIL WIDE
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 9.3×5.9
- Boards
- —
WINBOND TSOP-54L TYPE2 400MIL
celestial-altium-Leaded_SOP
TSOP, 54-Leads, Body 22.22x10.16mm, Pitch 0.80mm, IPC Medium Density
- Pads
- 54
- SMD
- 13.2×22.9
- Boards
- —
WINBOND WSON-8 6x5mm
celestial-altium-Leadless_SON
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 7.2×5.6
- Boards
- —
WINBOND WSON-8 8x6MM E
celestial-altium-Leadless_SON
WSON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 9.2×6.6
- Boards
- —