Footprints

128 footprints matching “XP

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

128 footprints · page 1 of 6

Matched by name and keywords. Search by meaning instead

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
16
SMD
7.7×5.5
Boards
579

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads
10
SMD
6.3×3.5
Boards
153

SSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)

Pads
16
SMD
7.4×5.4
Boards
98

Nexperia_CFP3_SOD-123W

FP3D

Diode_SMD

Nexperia CFP3 (SOD-123W), https://assets.nexperia.com/documents/outline-drawing/SOD123W.pdf

Pads
2
SMD
4.5×2.2
Boards
91

SW_SPST_Omron_B3FS-100xP

FP3D

Button_Switch_SMD

Surface Mount Tactile Switch for High-Density Mounting, 3.1mm height, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3fs.pdf

Pads
2
SMD
10.1×6.8
Boards
63

TI_SO-PowerPAD-8

FP3D

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)

Pads
9
SMD
8.0×5.4
Boards
33

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads
44
SMD
13.3×13.3
Boards
27

BUS_PCIexpress_x1

FP

Connector_PCBEdge

PCIexpress Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70

Pads
36
Mount
21.3×9.4
Boards
25

Diodes_SO-8EP

FP

Package_SO

8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)

Pads
9
SMD
7.0×5.1
Boards
22

BUS_PCIexpress_x4

FP

Connector_PCBEdge

PCIexpress Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70

Pads
64
Mount
35.3×9.4
Boards
18

NXP_LGA-8_3x5mm_P1.25mm_H1.1mm

FP

Package_LGA

NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42)

Pads
8
SMD
4.0×5.5
Boards
13

SW_SPST_Omron_B3FS-101xP

FP3D

Button_Switch_SMD

Surface Mount Tactile Switch for High-Density Mounting, 4.3mm height, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3fs.pdf

Pads
2
SMD
10.1×6.8
Boards
9

Nexperia_DSN1608-2_1.6x0.8mm

FP

Diode_SMD

Diode SMD DSN1608, 1.6 x 0.8 x 0.29 mm, https://assets.nexperia.com/documents/package-information/SOD964.pdf

Pads
2
SMD
2.1×1.3
Boards
9

Diodes_PSOP-8

FP

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)

Pads
9
SMD
7.4×5.4
Boards
9

BatteryHolder_MPD_BA9VPC_1xPP3

FP

Battery

1xPP3 (9V) battery holder, Memory Protection Devices P/N BA9VPC, http://www.memoryprotectiondevices.com/datasheets/BA9VPC-datasheet.pdf

Pads
2
THT
55.9×32.4
Boards
6

Converter_DCDC_XP_POWER-ITxxxxxS_THT

FP3D

Converter_DCDC

DCDC-Converter, XP Power, IT series, 3W, 1500V isolation, SIP-9, https://www.xppower.com/portals/0/pdfs/SF_IT.pdf

Pads
7
THT
11.7×28.5
Boards
6

Nexperia_CFP15_SOT-1289

FP

Package_TO_SOT_SMD

Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf

Pads
3
SMD
7.5×4.8
Boards
6

SW_SPST_Omron_B3FS-105xP

FP3D

Button_Switch_SMD

Surface Mount Tactile Switch for High-Density Mounting, 7.3mm height, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3fs.pdf

Pads
2
SMD
10.1×6.8
Boards
5

BUS_PCI_Express_Mini_Full

FP

Connector_PCBEdge

Mini-PCI Express bus connector full size with clips (https://s3.amazonaws.com/fit-iot/download/facet-cards/documents/PCI_Express_miniCard_Electromechanical_specs_rev1.2.pdf#page=24)

Pads
53
SMD
32.6×57.0
Boards
5

Converter_DCDC_XP_POWER_JTExxxxDxx_THT

FP3D

Converter_DCDC

DCDC-Converter, XP POWER, Type JTE06 Series, Dual Output

Pads
8
THT
20.8×32.3
Boards
5

Converter_DCDC_XP_POWER-IAxxxxS_THT

FP3D

Converter_DCDC

DCDC-Converter, XP Power, IA series, 3.3-24V inputs, 1000V isolation, SIP-7, https://www.xppower.com/portals/0/pdfs/SF_IA.pdf

Pads
5
THT
7.6×20.8
Boards
5

BUS_PCIexpress_x8

FP

Connector_PCBEdge

PCIexpress Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70

Pads
98
Mount
52.3×9.4
Boards
4

Nexperia_DSN0603-2_0.6x0.3mm_P0.4mm

FP

Diode_SMD

SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body (https://assets.nexperia.com/documents/package-information/SOD962-2.pdf https://www.nexperia.com/packages/SOD962-2.html)

Pads
2
SMD
0.9×0.6
Boards
4

DHVQFN-16-1EP_2.5x3.5mm_P0.5mm_EP1x2mm

FP

Package_DFN_QFN

DHVQFN, 16 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf)

Pads
17
SMD
3.7×4.7
Boards
4