Footprints

284 footprints matching “chip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

284 footprints · page 1 of 12

Matched by name and keywords. Search by meaning instead

ChipFET-1206-8

FP—

agg-agg

Pads: 8
SMD: 2.6×3.6
Boards: —

CHIPv1_0

FP—

agg-agg

Pads: 80
THT: 43.0×62.5
Boards: —

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

ESP32-WROOM-32

FP3D

RF_Module

Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf

Pads: 39
SMD: 48.0×41.3
Boards: 548

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

R_Array_Convex_4x0603

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf)

Pads: 8
SMD: 3.1×3.7
Boards: 299

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

R_Array_Convex_4x0402

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf)

Pads: 8
SMD: 2.0×2.5
Boards: 87

R_Array_Concave_4x0603

FP3D

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads: 8
SMD: 3.1×3.8
Boards: 78

ESP32-WROOM-32U

FP3D

RF_Module

Single 2.4 GHz Wi-Fi and Bluetooth combo chip with U.FL connector, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf

Pads: 39
SMD: 19.5×20.2
Boards: 72

R_Array_Concave_4x0402

FP3D

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf)

Pads: 8
SMD: 2.0×2.5
Boards: 39

R_Array_Convex_4x1206

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)

Pads: 8
SMD: 4.4×5.7
Boards: 34

L_Murata_DFE201610P

FP3D

Inductor_SMD

Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)

Pads: 2
SMD: 2.5×2.1
Boards: 32

R_Array_Convex_4x0612

FP—

Resistor_SMD

Precision Thin Film Chip Resistor Array, VISHAY (see http://www.vishay.com/docs/28770/acasat.pdf)

Pads: 8
SMD: 2.6×3.7
Boards: 25

LED_LiteOn_LTST-C19HE1WT

FP—

LED_SMD

LiteOn RGB LED; https://optoelectronics.liteon.com/upload/download/DS22-2008-0044/LTST-C19HE1WT.pdf

Pads: 4
SMD: 2.1×2.8
Boards: 24

R_Array_Convex_8x0602

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR18 (see mnr_g.pdf)

Pads: 16
SMD: 3.1×4.5
Boards: 24

ESP32-C6-MINI-1

FP—

RF_Module

2.4 GHz Wi-Fi, Bluetooth, Zigbee and Thread combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-c6-mini-1_mini-1u_datasheet_en.pdf

Pads: 53
SMD: 43.2×31.9
Boards: 22

ESP32-S2-MINI-1

FP—

RF_Module

2.4 GHz Wi-Fi and Bluetooth combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf

Pads: 65
SMD: 45.4×35.3
Boards: 20

R_Array_Convex_2x0606

FP—

Resistor_SMD

Precision Thin Film Chip Resistor Array, VISHAY (see http://www.vishay.com/docs/28770/acasat.pdf)

Pads: 4
SMD: 2.6×2.1
Boards: 13

ESP32-S2-MINI-1U

FP—

RF_Module

2.4 GHz Wi-Fi and Bluetooth combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf

Pads: 65
SMD: 15.9×15.9
Boards: 12

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9