Footprints

1,876 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,876 footprints · page 1 of 79

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TO-92_Inline

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 988

DIP-8_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×10.7
Boards: 956

DIP-16_W7.62mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 16
THT: 9.7×20.8
Boards: 708

DIP-14_W7.62mm

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 14
THT: 9.7×18.3
Boards: 626

DIP-14_W7.62mm_Socket

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 14
THT: 10.7×18.4
Boards: 391

DIP-16_W7.62mm_Socket

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 16
THT: 10.7×20.9
Boards: 373

TO-92_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 7.1×4.7
Boards: 358

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

DIP-20_W7.62mm

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 20
THT: 9.7×25.9
Boards: 318

DIP-28_W7.62mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 28
THT: 9.7×36.1
Boards: 301

DIP-40_W15.24mm

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 40
THT: 17.3×51.3
Boards: 272

DIP-4_W7.62mm

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 4
THT: 9.7×5.6
Boards: 252

DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

DIP-20_W7.62mm_Socket

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 20
THT: 10.7×26.0
Boards: 227

DIP-14_W7.62mm_Socket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

DIP-14_W7.62mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

DIP-16_W7.62mm_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 16
THT: 10.5×20.8
Boards: 199

DIP-16_W7.62mm_Socket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 16
THT: 10.7×20.9
Boards: 189

TO-92

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 181

DIP-40_W15.24mm_Socket

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 40
THT: 18.3×51.4
Boards: 179

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

DIP-28_W15.24mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 28
THT: 17.3×36.1
Boards: 172

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136