Footprints

3,181 footprints matching “package”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

3,181 footprints · page 1 of 133

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SOT-23

FP3D

Package_TO_SOT_SMD

SOT, 3 Pin (JEDEC TO-236 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=TO-236)

Pads: 3
SMD: 3.9×3.4
Boards: 5,749

SOIC-8_3.9x4.9mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)

Pads: 8
SMD: 7.4×5.4
Boards: 3,516

SOT-23-5

FP3D

Package_TO_SOT_SMD

SOT, 5 Pin (JEDEC MO-178 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads: 5
SMD: 4.1×3.4
Boards: 3,190

SOT-223-3_TabPin2

FP3D

Package_TO_SOT_SMD

module CMS SOT223 4 pins

Pads: 3
SMD: 8.8×7.2
Boards: 2,785

SOT-23-6

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (JEDEC MO-178 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads: 6
SMD: 4.1×3.4
Boards: 2,266

Crystal_SMD_3225-4Pin_3.2x2.5mm

FP3D

Crystal

SMD3225/4, Crystal, 3.2x2.5mm package, SMD, http://www.txccrystal.com/images/pdf/7m-accuracy.pdf

Pads: 4
SMD: 4.2×3.5
Boards: 1,419

TO-220-3_Vertical

FP3D

Package_TO_SOT_THT

TO-220-3, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf

Pads: 3
THT: 10.5×4.9
Boards: 1,335

SOIC-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SOIC, 16 Pin (JEDEC MS-012, variation AC, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 1,078

TO-92_Inline

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 988

DIP-8_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×10.7
Boards: 956

SOIC-14_3.9x8.7mm_P1.27mm

FP3D

Package_SO

SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 908

LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 20
SMD: 7.7×7.0
Boards: 731

DIP-16_W7.62mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 16
THT: 9.7×20.8
Boards: 708

LQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)

Pads: 64
SMD: 13.4×13.4
Boards: 663

TO-252-2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 3
SMD: 11.1×7.0
Boards: 658

DIP-14_W7.62mm

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 14
THT: 9.7×18.3
Boards: 626

SOT-363_SC-70-6

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=170, JEDEC MO-203, variant AB, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)

Pads: 6
SMD: 2.9×2.2
Boards: 586

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

SOT-23-3

FP3D

Package_TO_SOT_SMD

SOT, 3 Pin (JEDEC MO-178 inferred 3-pin variant https://www.jedec.org/document_search?search_api_views_fulltext=MO-178)

Pads: 3
SMD: 4.1×3.4
Boards: 519

TSSOP-14_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 14
SMD: 7.7×5.5
Boards: 507

TQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)

Pads: 32
SMD: 10.3×10.3
Boards: 503